56G MezzaWave Connectors Provide Drop-In Compatibility for Rugged Systems
TE Connectivity’s new connector and cable assembly family delivers data rates up to 56 Gbps PAM4, integrated power pins, and VITA compliance for high-density modular systems.
To meet the rising performance demands of modern digital architecture, hardware developers require interconnect components that balance rapid signal transmission with robust physical reliability. The newly introduced 56G MezzaWave connector and cable assembly family aims to address these challenges in dense packaging. Built on an open-pin-field array platform, these board-to-board interconnects maintain signal integrity while handling high-bandwidth PAM4 data transmission at up to 56 Gbps.
MezzaWave connector and cable assembly family supports 56 Gbps PAM4. Image used courtesy of TE Connectivity
Electrical and Mechanical Features
Architects designing high-speed modular systems face strict space constraints. The series minimizes PCB real estate with a 1.27mm pitch. To simplify power distribution and reduce overall component count on the circuit board, the connectors integrate dedicated 1.6A power pins directly into the housing.
The product family is supplied in a variety of physical footprints to optimize board layouts. Available pin counts range from 80 to 560, while available layout orientations include 4×20, 20×8, 10×30, 8×40, 10×40, and 14×40. Engineering flexibility is further enhanced with multiple stack heights ranging from 7mm to 10mm.
Solder ball terminations enable the physical connection to the printed circuit board. Utilizing ball grid array (BGA) technology, the interfaces provide rugged mechanical stability and consistent electrical performance. The components are rated to endure up to 1,000 mating cycles and are specified to operate reliably throughout a wide thermal range of -55ºC to 125ºC.
Standard Compliance and Applications
The mezzanine connectors provide drop-in compatibility with existing components, enabling engineering teams to implement hardware upgrades without extensive system redesigns. Interoperability across diverse multi-vendor ecosystems is maintained by adhering to VMEbus International Trade Association (VITA) and American National Standards Institute (ANSI) standards. Specifically, the interconnects comply with the VITA 57.1–FMC and VITA 57.4–FMC+ specifications.
The 56G MezzaWave portfolio is engineered for demanding deployments that require substantial signal throughput in tight spaces. Typical applications include field-programmable gate array-based systems, electronic design automation, multiple-input, multiple-output systems, and high-speed data acquisitions. The robust BGA construction makes these components suitable for integration into carrier boards, mezzanine modules, modular server designs, and ruggedized embedded systems across edge computing, telecommunications, networking, industrial automation, robotics, medical devices, automotive electronics, and aerospace and defense systems.
