ASRock Industrial DSC-NV003-WT Jetson AGX Orin devkit with up to 12 PoE ports, PCIe Gen4 x8 slots

DSC-NV003-WT Jetson AGX Orin devkit

ASRock Industrial has recently introduced the DSC-NV003-WT, a Jetson AGX Orin developer kit designed for Edge AI workloads. With up to 275 TOPS of AI performance and a wide operating temperature range, it’s suitable for robotics, drones, industrial automation, smart cities, and vision-based applications.

The kit supports multiple NVIDIA Jetson AGX Orin SKUs (Industrial/64GB/32GB) and supports 12 PoE ports for vision systems, a 120-pin MIPI connector for up to four 4-lane MIPI or GMSLII cameras, and dual PCIe Gen4 x8 slots for expansion. Storage options include onboard 64GB eMMC, microSD, and NVMe SSD via M.2 Key-M. Connectivity options include a GbE and a 2.5GbE LAN, optional 5G/4G LTE, and Wi-Fi. I/O options include 4x USB 3.2, USB-C (device mode), dual RS-232/422/485, and audio headers. The carrier board also exposes GPIO, I2C, SPI, CAN, and PWM through a 40-pin header. The kit supports a wide operating voltage range of 12–48V DC, making it suitable for various applications.

DSC-NV003-WT kit Top and Bottom

DSC-NV003-WT Devkit Specifications:

• Supported SoM(System on Module)
  • NVIDIA Jetson AGX Orin Industrial (JAOi)
  • NVIDIA Jetson AGX Orin 64GB (JAO 64GB)
  • NVIDIA Jetson AGX Orin 32GB (JAO 32GB)
• Storage
  • 64GB eMMC 5.1 flash (on module)
  • M.2 Key-M 2280 slot for PCIe Gen3 x4 or PCIe Gen4 x4 NVMe SSD (airflow required)
  • MicroSD card slot (UHS-I/SDR-50)
  • Additional options via expansion slots
• Display
  • HDMI 2.0 output
• Camera
  • A 120-pin MIPI connector with up to 4x 4-lane MIPI camera or 4x 4-lane GMSLII camera
  • Up to 12x PoE camera connectors (via modules/add-on cards)
• Networking
  • 1x GbE RJ45 port (Marvell 88E1512 PHY)
  • 1x 2.5GbE RJ45 port (Intel I226IT)
  • Up to 12x PoE (IEEE 802.3af) ports via M.2/PCIe add-on cards
  • Nano SIM slot
  • Antenna up to 4x 5G/4G LTE + 2x Wi-Fi
• Audio
  • MIC-IN connector
  • Speaker-out (L/R, 2W+2W)
  • Reserved audio panel header for MIC IN/LINE OUT
• USB
  • 4x USB 3.2 Gen2 Type-A (options: with or without lock)
  • 1x USB 2.0 Type-C (device mode, for OS flash)
• Serial
  • 2x RS-232/422/485 via 1x DB9 connecror and 1x wafer connector
• Expansion
  • M.2 Key-B 3042/3052/2280 with PCIe Gen3 x1 + USB 3.2 for 4G/5G modules, PoE, or SSD
  • M.2 Key-E 2230 with PCIe Gen3 x1 + USB 2.0 for Wi-Fi/Bluetooth
  • (Option) 1x M.2 Key-E 2260 for PoE module
  • 2x PCIe x16 slots (2x PCIe Gen4 x8 lanes)
  • 40-pin expansion header: I2S, Digital Mic, 2x I2C, SPI, UART, 2x CAN Bus, 2x PWM, GPIO
• Misc
  • Automation header (power/reset/strap signals)
  • Wake-on-LAN (I226IT)
  • TPM 2.0
  • System status LEDs, buttons (power, reset, OS flash)
• Power
  • 12V–48V DC input via Phoenix connector
  • 80V surge protection; OVP, UVP, OCP, reverse protection
  • Optional AC/DC adapters:
  • 120W (19V, 6.32A)
  • 330W (24V, 13.75A) for PoE/5G SKU
• Dimensions
  • 210.31 × 190.32 mm
• Operating temperature:
  • –25 to 45 °C (non-PoE SKUs, with airflow 0.5–0.8 m/s)
  • –25 to 35 °C (PoE SKUs, with airflow 0.5–0.8 m/s)
• Storage temperature – –25 to 80 °C
• Humidity – 5–85% RH (operating), 30–70% RH (storage)

Jetson AGX Orin devkit ports

In terms of software support, the development can be programmed with NVIDIA’s JetPack 6.2+ SDK, which includes the usual libraries, tools, and documentation for AI inference, computer vision, and robotics development.

At the time of writing, the company has not provided any pricing information for the product. More details can be found on the company’s product page, with additional information available in the press release.

All images are courtesy of ASRock.