Dragonwing Q-2390 and IQ-2390 Bring AI and Real-Time Processing to IoT

Qualcomm has expanded its edge computing portfolio by introducing the Dragonwing Q-2390 and IQ-2390 processors. Designed for consumer, commercial, and industrial IoT applications, these new SoCs integrate vision, deterministic networking, and real-time processing into highly cost-optimized packages.

The new processors target two distinct device categories, where the Dragonwing Q-2390 features on-device AI, display support, and optional LTE Cat 4 and GNSS connectivity, and is designed for commercial and consumer applications such as retail point-of-sale systems, smart displays, home robots, and enterprise terminals.

The Dragonwing IQ-2390, on the other hand, is the first processor in Qualcomm’s new IQ2 Series and features dual Gigabit Ethernet with Time-Sensitive Networking (TSN), designed for industrial applications like building management, PLCs, industrial vision systems, and energy infrastructure.

Qualcomm Dragonwing Q-2390 and IQ-2390 Specifications

• CPU:
  • 1x Arm Cortex-A78 core up to 1.5 or 1.9 GHz depending on SKU
  • 3x Arm Cortex-A55 cores up to 1.5 or 1.9 GHz depending on SKU
  • Optional SiFive E61 RISC-V real-time core up to 600 MHz with 768 KB memory
  • Cache: 512 KB L3 cache
• GPU: Qualcomm Adreno 704 up to 1.1 GHz
• VPU:
  • Decode: Up to 1080p @ 30 fps H.264, H.265, VP9
  • Encode: Up to 1080p @ 30 fps H.264, H.265
• DPU (Display Processing Unit): Qualcomm Adreno 921
• Audio DSP: Qualcomm Hexagon V66 up to 1.1 GHz
• NPU: Qualcomm Hexagon up to 1.1 TOPS
• Memory: Dual-channel 16-bit LPDDR4x up to 1.8 GHz
• Storage: eMMC 5.1, SD 3.0
• Display Interface: 4-lane MIPI DSI up to 1080p60
• Camera Interfaces:
  • Up to 2x 4-lane MIPI CSI
  • 13 MP dual camera (ZSL, 30 fps)
  • 25 MP single camera (ZSL, 30 fps)
• Audio: Optional WSA8865 codec
• Networking:
  • 2x Gigabit Ethernet with TSN
  • Wi-Fi 5 and Bluetooth 5.0/5.1 via WCN3950/WCN398x
  • Optional 4G LTE Cat 4
• GNSS: Optional Gen 9 VT v4-Lite GPS L1
• USB: USB 3.1 Type-C/Micro USB, 1x USB 2.0 Type-C
• Other I/Os: 10x QUP, 155x GPIO, UART, I²C, SPI along wiht a PCIe 2.0 x1 port
• Dimensions:
  • Dragonwing Q-2390: 12 x 12 x 0.92 mm; 0.4 mm ball pitch
  • Dragonwing IQ-2390: 21.3 x 18.4 x 1.82 mm; 0.8 mm ball pitch
• Temperature Range:
  • Q-2390 AA variants: -30°C to +95°C
  • Q-2390 AB variants and IQ-2390: -30°C to +115°C
• Longevity: Available until 2036

Block diagram of the Qualcomm Dragonwing Q-2390 processor, showing its processing, connectivity, multimedia, memory, and I/O features.Block diagram of the Qualcomm Dragonwing IQ-2390 processor and its integrated computing, I/O, memory, display, camera, audio, and networking features

Qualcomm supports the Cortex-A cores with Android, Yocto Linux, and Ubuntu. Versions with the RISC-V real-time core also support Zephyr RTOS. Both processors are expected to remain available until 2036, making them suitable for products with long development and support cycles.

Qualcomm will showcase System-on-Modules (SoMs) based on the Dragonwing Q-2390 and IQ-2390 at IFA 2026. An early access program is already available to selected customers, while evaluation kits are expected in early 2027. More information is available on the products page and in the press release.

Images used courtesy of Qualcomm