Electronics Lab

Forlinx Releases Rockchip RK3506J SoMs for Industrial and Embedded Applications

Forlinx FET3506J-C/S SoMs powered by Rockchip RK3506J offer low-power, industrial-grade solutions with rich I/O, long-term support, and carrier boards for rapid prototyping.



FET3506J-C System on Module (SoM) powered by the Rockchip RK3506J

The FET3506J-C SoM from Forlinx is a compact, industrial-grade System-on-Module powered by the Rockchip RK3506J, a triple-core Cortex-A7 processor paired with a Cortex-M0 for real-time tasks. Measuring just 40 x 29 mm and using slim 2 mm board-to-board connectors, the module offers reliable performance in a space-efficient design. With a power consumption of only 0.7 W under full load and support for operation in temperatures up to +85 °C without active cooling, it is well-suited for embedded and industrial applications where size, efficiency, and reliability are critical.

FET3506J-C System on Module specifications:

  • Processor:
    • Rockchip RK3506J application processor
    • 3x Arm Cortex-A7 cores, up to 1.5 GHz
    • 1x Cortex-M0 core @ 200 MHz for real-time tasks
  • Graphics:
    • Basic 2D GPU
    • No hardware VPU or NPU acceleration
  • Memory and Storage:
    • 256 MB or 512 MB DDR3 RAM
    • 256 MB NAND Flash or 8 GB eMMC
    • Optional interfaces when storage type not soldered:
      • 4-bit SDIO (if eMMC not populated)
      • FSPI (if NAND not populated)
  • Connectivity and Expansion:
    • Compact design with 2x 80-pin board-to-board connectors (0.5 mm pitch, 2 mm height)
    • Multiplexed interfaces include:
      • MIPI DSI (2-lane, up to 1.5 Gbps/lane)
      • 24-bit RGB LCD interface (up to 1280 x 1280 @ 60 Hz)
      • FLEXBUS high-speed parallel interface
      • DSMC for PSRAM/FPGA communication (8/16-bit master, 8-bit slave)
  • Industrial I/O:
    • 2x CAN-FD interfaces (tested up to ≥87% bus load)
    • 2x 10/100 Mbps Ethernet (RMII)
    • 2x USB 2.0 ports (one with OTG support)
  • Audio:
    • Multiple SAI channels
    • 4ch PDM, SPDIF, audio ADC, audio DSM
  • Other interfaces:
    • 3x SPI, 3x I²C (up to 1 Mbps), up to 6x UART (UART0 for debug)
    • Up to 11x PWM
    • Up to 4x 10-bit SAR ADC (1 MS/s, 0–1.8 V input)
    • Up to 8x Touchkey
    • Up to 76 GPIOs (70 inputs, 76 outputs)
  • Power supply: 5 V DC
  • Dimensions: 40 x 29 mm
  • Operating temperature: –40 °C to +85 °C

FET3506J-C System on Module (SoM) - powered by the Rockchip RK3506J SoM

FET3506J-C System on Module (SoM)

The FET3506J-C is backed by a solid software stack, including a Linux 6.1 BSP, LVGL 9.2 for GUI development, AMP for efficient workload distribution, and Linux RT for real-time tasks. Forlinx also provides storage optimizations and eMMC health diagnostics to improve reliability and extend service life.

At the time of writing, Forlinx has not disclosed pricing details for the FET3506J-C SoM. Further information is available on the official product page.

Forlinx FET3506J-S SoM

Forlinx FET3506J-S Rockchip RK3506J SoM

Forlinx FET3506J-S SoM powered by the Rockchip RK3506J

The FET3506J-S System on Module (SoM) from Forlinx is built around the Rockchip RK3506J processor, an industrial-grade SoC designed for smart embedded and industrial applications. The module has been rigorously tested for reliability in harsh environments and provides long-term supply assurance of up to 15 years, making it suitable for projects requiring stability and extended lifecycle support.

Powered by a triple-core Cortex-A7 processor with a Cortex-M0 real-time core, the RK3506J delivers balanced performance with low power consumption of around 0.7 W. It integrates a rich set of industrial interfaces including RMII Ethernet, UART, CAN-FD, and display options (MIPI DSI, RGB), while also offering advanced features such as DSMC for high-speed ARM-FPGA communication and matrix I/O configuration for flexible pin assignments. This combination of efficiency, robust I/O, and thermal management makes it well-suited for industrial automation, medical devices, and smart energy systems.

Forlinx FET3506J-S SoM on Carrier Board

Forlinx FET3506J-S SoM on Carrier Board

Forlinx FET3506J-S SoM Specifications:

  • Processor:
    • Rockchip RK3506J industrial-grade SoC
    • Triple-core Arm Cortex-A7 up to 1.5/1.6 GHz
    • One Arm Cortex-M0 real-time core
  • Graphics:
    • 2D GPU for basic rendering
    • No VPU or NPU acceleration
  • Memory and Storage:
    • 256MB / 512MB / 1GB DDR3 RAM
    • 256MB NAND Flash or 8GB eMMC
    • Optional SDIO (4-bit) when eMMC not populated
    • FSPI boot support (when NAND not used)
  • Display Interfaces:
    • Up to 1x 2-lane MIPI-DSI, 1.5 Gbps per lane
    • RGB888 24-bit LCD interface, max 1280×1280 @ 60Hz
    • Built-in VOP controller, one display output at a time
    • RGB, FLEXBUS, and DSMC are multiplexed (only one active)
  • Audio:
    • 4x SAI (configurable lanes)
    • 4-channel PDM microphone input
    • SPDIF TX/RX
    • Audio ADC
    • 2x Audio DSM
  • Networking: 2x 10/100 Mbps Ethernet (RMII), full-/half-duplex
  • USB: 2x USB 2.0 ports (one supports OTG)
  • Industrial and Peripheral Interfaces:
    • 2x CAN 2.0 / CAN-FD
    • 3x SPI (two support master/slave, one slave-only)
    • Up to 6x UART (UART0 as debug)
    • 3x I²C (7/10-bit addressing, up to 1 Mbps)
    • Up to 11x PWM outputs (one reserved internally)
    • Up to 4x 10-bit SARADC (1 MS/s, 0–1.8 V input)
    • Up to 8x capacitive Touch Keys
    • Up to 76 GPIOs (70 GPI / 76 GPO, with restrictions on some pins)
  • High-Speed Expansion Buses:
    • FLEXBUS: flexible parallel interface for high-speed I/O
    • DSMC bus: supports PSRAM and ARM-FPGA communication
      • Master mode: x8 / x16 data bits
      • Slave mode: x8 data bits
  • Debug and Development:
    • JTAG/SWD debugging (multiplexed with UART0)
    • Flashing via USB OTG
  • Power:
    • Input voltage: 5 V DC
    • Typical consumption: ~0.7 W
  • Compact form factor: 44 × 35 mm
  • Connection: 146 castellated stamp holes, 1 mm pitch
  • Operating Range: –40 °C to +85 °C industrial temperature range
  • Longevity: 10–15 years supply assurance

Forlinx FET3506J-S SoM Front and back side - powered by the Rockchip RK3506J SOM

Forlinx FET3506J-S SoM Front and back side

The FET3506J-S SoM powered by the Rockchip RK3506J is supported by a comprehensive software ecosystem. Forlinx offers a Linux 6.1 Board Support Package (BSP) optimized for industrial applications, along with LVGL 9.2 for developing touch-based GUIs. The module also supports AMP (Asymmetric Multi-Processing) to balance workloads across cores and Linux RT patches for reliable real-time performance. In addition, enhanced storage drivers and an eMMC health monitoring utility help ensure long-term reliability by detecting potential failures early, thereby improving system uptime and data safety.

OK3506J-C and OK3506J-S carrier board

To complement the FET3506J-C and FET3506J-S SoMs, Forlinx also offers the OK3506J-C and OK3506J-S carrier boards, designed to simplify evaluation and rapid prototyping. These carrier boards break out the SoM’s rich set of interfaces into standard connectors, making it easier for developers to test features such as Ethernet, USB, CAN-FD, display, and audio. By combining the compact SoM with its respective carrier board, engineers can quickly validate performance, accelerate development, and shorten time-to-market for industrial and embedded applications.

OK3506J-C and OK3506J-S Carrier BoardOK3506J-C and OK3506J-S Carrier Board

OK3506J-C and OK3506J-S carrier board Specifications

  • Core Module: Supports FET3506J-C and FET3506J-S SoMs (Rockchip RK3506J)
  • Storage: MicroSD card slot (only available with NAND flash SoM version)
  • Display Interfaces:
    • 1x 2-lane MIPI DSI connector (single channel, up to 1.5 Gbps/lane)
    • 1x 24-bit RGB LCD connector, up to 1280×1280 @ 60Hz
    • Only one display interface supported at a time
  • Audio:
    • 3.5mm audio jack (stereo output + microphone input)
    • Onboard microphone
  • Networking:
    • 2x 10/100 Mbps Ethernet RJ45 ports (RMII)
    • Wi-Fi 4 + Bluetooth 4.0 module (Realtek RTL8723DU over USB 2.0) with SMA antenna connector
    • Optional 4G LTE module via mini PCIe socket, Nano SIM slot, and SMA antenna connector
  • USB:
    • 1x USB Type-C port (supports OTG and flashing, master/slave selectable via DIP switch)
    • 2x USB 2.0 Type-A ports
  • Serial and Industrial Interfaces:
    • 2x CAN/CAN-FD with isolation and protection
    • 1x RS485 with isolation and protection
    • Serial debugging via terminal block
  • Expansion:
    • DSMC header for high-speed FPGA/PSRAM communication
    • FSPI header (multiplexed with NAND pins, optional/empty by default)
  • Debugging:
    • USB to serial converter via USB Type-C for debug output
    • JTAG header (multiplexed with UART0 debug pins)
  • Miscellaneous
    • 6x hardware buttons: Reset, Maskrom, VOL+, VOL-, Menu, ESC
    • Onboard RTC chip with coin-cell battery holder
    • Power on/off switch
  • Power Supply: 12V DC input via barrel jack

OK3506J-C (Top) and OK3506J-S (Bottom) Carrier Board Specifications

OK3506J-C (Top) and OK3506J-S (Bottom) Carrier Board Specifications

Previously, we covered the Forlinx OK536-C SBC based on the Allwinner T536 SoC with the FET536-C SoM, as well as the Forlinx FET-MX95xx-C SoM and OK-MX95xx-C development board powered by NXP’s i.MX 95 SoC. We also wrote about the Toradex Aquila i.MX95 and several other SoMs—feel free to check those out if you’re interested in related platforms.

At the time of writing, Forlinx has not disclosed pricing details for the FET3506J-S SoM and the OK3506J-S carrier board. More information is available on the official product page and in the press release.

Images used courtesy of Forlinx.

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