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Würth Elektronik Launches Heat Sink Portfolio for Power Electronics and ICs
Würth Elektronik Launches Heat Sink Portfolio for Power Electronics and ICs
Components Industrial
Nanomade and PolyIC Unveil Transparent Capacitive Touch and Force Sensing Foil
Nanomade and PolyIC Unveil Transparent Capacitive Touch and Force Sensing Foil
Displays Industrial Sensors
Dual-Channel Synchronous Rectification Controller Tackles LLC Applications
Dual-Channel Synchronous Rectification Controller Tackles LLC Applications
Components ICs Robotics
Extreme Temperature Probe Tips Measure Direct Current in Harsh Environments
Extreme Temperature Probe Tips Measure Direct Current in Harsh Environments
Industrial IoT Test & Measurement
Infineon Integrates TLVR Technology Into a Compact Quad-Phase Power Module
Infineon Integrates TLVR Technology Into a Compact Quad-Phase Power Module
Data Centers ICs
Siglent Adds Cost-Effective, Entry-Level Model to Its Vector Network Analyzers
Siglent Adds Cost-Effective, Entry-Level Model to Its Vector Network Analyzers
RF / Wireless Test & Measurement
STMicroelectronics’ New Ultra-Wideband SoC Family Enhances Range and Power
STMicroelectronics’ New Ultra-Wideband SoC Family Enhances Range and Power
Automotive RF / Wireless SoC / SiP
pSemi’s New Power ICs Address Fast Charging and High-Voltage Conversion
pSemi’s New Power ICs Address Fast Charging and High-Voltage Conversion
ICs Power USB
AOS Launches Low- and Medium-Voltage MOSFETs With Double-Sided Cooling
AOS Launches Low- and Medium-Voltage MOSFETs With Double-Sided Cooling
ICs Semiconductors
Grinn Delivers High-Performance Edge AI in Tiny 25 x 25 mm System-on-Module
Grinn Delivers High-Performance Edge AI in Tiny 25 x 25 mm System-on-Module
AI / ML SoM / CoM