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Renesas Debuts Dual-Side-Cooled 650V GaN FET for 800V Data Centers

Renesas Debuts Dual-Side-Cooled 650V GaN FET for 800V Data Centers

Housed in a compact 8x8 mm package that sheds heat from both sides, the 20 mω device targets the power-dense conversion stages of ...

Data Centers Power Semiconductors by Electronics-Lab Staff
Lattice’s Mach-N2 FPGAs Add Post-Quantum Security to System Control

Lattice’s Mach-N2 FPGAs Add Post-Quantum Security to System Control

New secure control FPGAs pair on-chip flash and quantum-resistant cryptography for long-lifecycle infrastructure designs.

Control Data Centers FPGA by Electronics-Lab Staff
EPC’s EPC2370 GaN FET Targets High-Current AI Server Power Rails

EPC’s EPC2370 GaN FET Targets High-Current AI Server Power Rails

An 18 V eGaN transistor promises sub-milliohm conduction losses and dense power delivery for emerging 800 VDC data center...

Data Centers Power Semiconductors by Electronics-Lab Staff
IBM’s New Mainframe Chip Runs Arm and IBM Z Instructions Natively

IBM’s New Mainframe Chip Runs Arm and IBM Z Instructions Natively

A 2-nanometer processor core natively runs Arm and IBM Z instructions, allowing Arm-native Linux to operate alongside z/OS on the...

Data Centers Processors Semiconductors by Electronics-Lab Staff
AMD’s 6th Gen EPYC CPUs Split Server Duties for Agentic AI

AMD’s 6th Gen EPYC CPUs Split Server Duties for Agentic AI

The new EPYC lineup assigns distinct silicon to running agents, feeding accelerators, and handling everyday enterprise compute.

AI / ML Data Centers Processors by Electronics-Lab Staff
Rambus Debuts DDR5 9600 RDIMM Chipset for AI Servers

Rambus Debuts DDR5 9600 RDIMM Chipset for AI Servers

A new registering clock driver pushes server memory to 9600 MT/s, targeting bandwidth-hungry agentic AI and HPC workloads.

AI / ML Data Centers Memory by Electronics-Lab Staff
The Approach to AI Infrastructure Is the Real Bubble

The Approach to AI Infrastructure Is the Real Bubble

What if the AI bubble isn't the technology—it's the assumption that frontier-scale training infrastructure is what enterprises w...

AI / ML Business Data Centers Embedded and Edge by Doug Milburn, 45Drives
SparkPNT GNSS Disciplined Oscillator Delivers Sub-Nanosecond Timing

SparkPNT GNSS Disciplined Oscillator Delivers Sub-Nanosecond Timing

Powered by Septentrio mosaic-T and a Rakon OCXO, the GNSSDO+ provides ultra-precise GNSS timing, 10 MHz output, and AtomiChron...

Control Data Centers by Sayantan Nandy
ASRock AI BOX-A395 Packs Ryzen AI Max+ Power for Edge AI

ASRock AI BOX-A395 Packs Ryzen AI Max+ Power for Edge AI

Compact edge system with 16-core Ryzen AI Max+, 50 TOPS NPU, up to 128GB LPDDR5X, and 10GbE for local AI workloads without...

Comm and Networking Data Centers IoT by Sayantan Nandy
Infineon Integrates TLVR Technology Into a Compact Quad-Phase Power Module

Infineon Integrates TLVR Technology Into a Compact Quad-Phase Power Module

The new TDM24745T module features four power stages, a trans‑inductor voltage regulator inductor, and decoupling capacitors, d...

Data Centers ICs by Electronics-Lab Staff
Beelink ME Pro Hybrid NAS Mini PC with N95/N150 and and Dual LAN

Beelink ME Pro Hybrid NAS Mini PC with N95/N150 and and Dual LAN

Compact hybrid NAS and Windows 11 mini PC with triple M.2 NVMe, dual SATA bays, dual 5GbE/2.5GbE LAN, and support for up to 72TB...

Data Centers Memory Software by Sayantan Nandy
Congatec Introduces Rugged COM Express Compact Module for Edge Applications

Congatec Introduces Rugged COM Express Compact Module for Edge Applications

The new conga-TCRP1 COM Express 3.1 Type 6 Compact modules are built on the AMD Ryzen AI Embedded P100 processor series and offer...

Data Centers Memory SoM / CoM by Electronics-Lab Staff