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Qorvo QPX0252 Targets Crowded X-Band Radar Arrays
SECO Launches Industrial HMI and SBC Powered by Dragonwing IQ-2390
Makerfabs nRF52840 Board Brings Bluetooth and UWB Tracking Together
Microchip Expands 10BASE-T1S Lineup With New Transceivers and Endpoints
Polyimide Tape for PCB Masking: Avoiding Edge Lift and Residue
Prevent Post-Launch Application Failures with Real-World Network Simulation
The Approach to AI Infrastructure Is the Real Bubble
Mastering the Curve: Layout Strategies for FPC Bend Radius and Reliability
Single Pair Ethernet: One Twisted Pair, Full Ethernet Performance
Analog To Digital Conversion - Sampling and Quantization
Positive Feedback in Electronic Circuits
Temperature Sensors
High Current Half Bridge with Over-Current Shutdown
3-Wire Electret Microphone Pre-Amplifier
12W Step Up DC-DC Converter using MAX1771
Sound to Light Color Shield for OLEDUINO v2
An Introduction to RF Theory, Practices, and Components: The Ins and Outs of RF
The Growing Decentralization of Power Grids
Fresh silicon pairs a compact three-pin interface with optional system-level features, letting designers connect eight or more...
A single-chip design folds resolver excitation and ASIL-D fault supervision into the same package as core voltage regulation for...
A compact wire-to-board design targets EMI-prone cabin wiring and aims to simplify harness assembly for next-generation ADAS and...
The automotive load switch bundles reverse-battery, overvoltage, and ESD protection into a single 4 mm square package.
NXP's new SoC pairs analog tuning with machine-learning-based sound isolation, aiming to simplify infotainment architectures and...
New AEC-Q200 series pairs metal-alloy cores with shielding to curb EMI while handling saturation currents up to 9 A.
A single-chip PMIC folds rotational-speed decoding into brake-by-wire voltage regulation, trimming parts count and board space in...
The iND881 SoC pairs a low-latency ISP with an NPU and DSP for smart-camera perception in vehicles and humanoid robots.
HMS Networks' PEAK brand debuts its first Automotive Ethernet device, bridging 100/1000BASE-T1 with standard Ethernet for vehicle development and...
The company’s latest automotive multilayer ceramic capacitors (MLCCs) offer increased capacitance for their size, targeting a...
The ST64UWB family supports the IEEE 802.15.4z and the upcoming IEEE 802.15.4ab standards, enabling next-generation...
A custom RAP1 chip using Arm Cortex-A720AE cores forms the core of Rivian’s third-generation autonomy platform for EVs, enabling e...