MIKROE-3512 Fusion for Arm® Development Board


https://www.electronics-lab.com/mikroe-3512-fusion-arm-development-board/

MikroElektronika presents a development board with a debugger over Wi-Fi The MIKROE-3512 Fusion for Armv8 development board from MikroElektronika is designed for rapid development of embedded applications. Redesigned from the ground up, it offers broad set of standards as well as several unique features never seen before in the world of embedded electronics: programming and debugging […]

TI introduces a new ultra-high-speed analog-to-digital converter


https://www.electronics-lab.com/ti-introduces-new-ultra-high-speed-analog-digital-converter/

ADC12DJ5200RF promises the fastest sampling rate and lowest power consumption. via www.eenewsembedded.com At 8 GHz, the ADC12DJ5200RF enables engineers to achieve as much as 20 percent higher analog input bandwidth than competing devices, which gives engineers the ability to directly digitize very high frequencies without the power consumption, cost and size of additional down-conversion. In […]

Sony’s ELTRES LPWAN Module Promises a Range of over 100 Km


https://www.electronics-lab.com/sony-release-communication-module-compatible-proprietary-eltres-low-power-wide-area-lpwa/

Contributing to delivery of wireless communication services that are stable over long distances and while moving at high speeds. Tokyo, Japan—Sony Corporation today announced the upcoming release of the CXM1501GR communication module, which is compatible with the ELTRES™ low-power wide area (LPWA) wireless communication standard that Sony has developed for IoT applications. Equipping IoT devices […]

Samsung’s Two New USB PD Controllers support up to 100W-charging


https://www.electronics-lab.com/samsungs-two-new-usb-pd-controllers-support-100w-charging/

SE8A is the first power delivery controller with embedded Secure Element for added protection against unauthorized chargers The new chips support up to 100W-charging and meets latest USB-PD 3.0 specifications. Samsung Electronics, a world leader in advanced semiconductor technology, today announced two USB Type-C power delivery (PD) controllers, SE8A and MM101. With the new PD […]

Sensirion – Evaluation Kit for Environmental Sensors with New Modular Approach


https://www.electronics-lab.com/sensirion-evaluation-kit-environmental-sensors-new-modular-approach/

Sensirion, the expert in environmental sensing, relaunches the evaluation kit SEK-Environmental Sensing with a new modular approach. The SEK-Environmental Sensing allows engineers to evaluate sensors and develop innovative sensor applications even more quickly and easily. The kit combines plug-and-play hardware with an easy-to-use viewer software, the ControlCenter, enabling in-depth evaluation of all Sensirion environmental sensors. […]

Intel launches first 10th Gen Ice Lake CPUs with 10nm fabrication


https://www.electronics-lab.com/intel-launches-first-10th-gen-ice-lake-cpus-10nm-fabrication/

10th Gen Intel Core Processors: Highly Integrated; Broad-Scale AI to the PC Intel announced the first 10th Gen Intel Core processors, bringing high-performance AI to the PC at scale with Intel® Deep Learning Boost (Intel DL Boost). The processors are built on the company’s 10nm process technology, new “Sunny Cove” core architecture and new Gen11 […]

Intrinsyc Announces Open-Q™ 212A SOM and Development Kit based on the Qualcomm® Home Hub 300 Platform


https://www.electronics-lab.com/intrinsyc-announces-open-q-212a-som-development-kit-based-qualcomm-home-hub-300-platform/

Designed for next-gen home hub products requiring advanced audio and multi-mode wireless capabilities, including Wi-Fi, Bluetooth, BLE, and Zigbee. Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of Things (IoT) products, today announced the availability of the Open-Q™ 212A system on module (“SOM”) and Home Hub […]

Maximizing power density and thermal performance in power-module designs


https://www.electronics-lab.com/maximizing-power-density-thermal-performance-power-module-designs/

Power-module designs require high power density, excep-tional thermal performance and a full feature set in order to be competitive. One way that power-module designs can meet these needs is with buck controllers with exter-nal metal-oxide-semiconductor field-effect transistors (MOSFETs) in their power architecture. Buck controllers with external MOSFETs allow current scalability and provide superior thermal spacing—both […]

Ruideng DPS5020 – 50V 20A Power Supply Module Review


https://www.electronics-lab.com/ruideng-dps5020-50v-20a-power-supply-module-review/

The DPS5020 is a constant voltage/current programmable control power supply module, that integrates analog and digital control in one device. Th e module is a 0-50V/0-20A Lab PSU module that comes in 2 parts, the main controller and a front panel. The main board has connections for input/output voltage as well as connection headers for Bluetooth […]

Future Electronics presents Ultra-low power Bluetooth 5.0 radio SoC


https://www.electronics-lab.com/future-electronics-presents-ultra-low-power-bluetooth-5-0-radio-soc/

The RSL10 from ON Semiconductor is an ultra-low power Bluetooth® 5.0 radio SoC for sensor and IoT applications. Designed for applications using 1.2V or 1.5V batteries, it runs from a supply between 1.1V and 3.3V without the need for a DC-DC converter. Ultra-low power Bluetooth 5.0 radio SoC – Free RSL10 evaluation kits available | […]