AAEON Introduces an “All-in-One” AI-Powered Robotics Development System
https://www.electronics-lab.com/aaeon-introduces-an-all-in-one-ai-powered-robotics-development-system/
The CEXD-INTRBL open robotic system utilizes Intel Core Ultra (Series 3) architecture and delivers up to 180 TOPS AI performance, targeting humanoid, autonomous mobile robot, and edge AI application development.
AAEON BOXER-8742AI Packs Jetson T4000 Power in a Fanless Edge Box PC
https://www.electronics-lab.com/aaeon-boxer-8742ai-packs-jetson-t4000-power-in-a-fanless-edge-box-pc/
Fanless embedded box PC with Jetson T4000, Blackwell GPU, and 1200 TFLOPS AI performance, targeting industrial AI, robotics, and machine vision workloads.
AAEON’s MIX-MTLD1 Brings Intel Core Ultra Performance to the Mini-ITX Form Factor
https://www.electronics-lab.com/aaeons-mix-mtld1-brings-intel-core-ultra-performance-to-the-mini-itx-form-factor/
A multi-pillar die processing architecture, 50% larger memory capacity, and out-of-band management support make the MIX-MTLD1 a cross-market AI standout.
New Intel Core Ultra 200H-Powered Developer Board Provides up to 97 TOPs
https://www.electronics-lab.com/aaeon-introduce-an-intel-core-ultra-200h-powered-developer-board-with-up-to-97-tops-of-ai-performance/
The UP Xtreme ARL from AAEON targets AI applications by combining the features of the new Intel Core Ultra 200H Series with industrial-grade I/O and rugged design features.
AAEON Leverages MediaTek Genio SoCs for its Latest SMARC Modules
https://www.electronics-lab.com/aaeon-leverages-mediatek-genio-socs-for-its-latest-smarc-modules-the-ucom-m700-and-ucom-m510/
The uCOM-M700 and uCOM-M510 combine the MediaTek Genio platform with flexible multimedia capabilities to provide industrial-grade SMARC modules.
AAEON’s PICO-MTU4-SEMI Hits the Market as the World’s Smallest Intel Core Ultra-Powered Mini PC
https://www.electronics-lab.com/aaeons-pico-mtu4-semi-hits-the-market-as-the-worlds-smallest-intel-core-ultra-powered-mini-pc/
This compact Mini PC is powered by the Intel Core Ultra 5 Processor 125U, includes up to 32GB LPDDR5 DRAM, and supports both Windows and Linux operating systems.
AAEON Releases PICO-TWL4, a Robust, Efficient 2.5” SBC for the Industrial Automation Market
https://www.electronics-lab.com/aaeon-releases-pico-twl4-a-robust-efficient-2-5-sbc-for-the-industrial-automation-market/
Premier embedded computing provider AAEON, has announced the release of the PICO-TWL4, a compact Pico-ITX board powered by Intel® Processor N-series processors (formerly Twin Lake). The board is available in SKUs featuring both the 6W, quad-core Intel® Processor N150 and the 15W, octa-core Intel® Core™ 3 Processor N355. On its ultra-small 100mm x 72mm PICO-ITX […]
AAEON’s NanoCOM-MTU Hosts 28W Intel Core Ultra CPUs on the COM Express Type 10 Form Factor
https://www.electronics-lab.com/aaeons-nanocom-mtu-hosts-28w-intel-core-ultra-cpus-on-the-com-express-type-10-form-factor/
The world’s first COM Express Type 10 module to host 28W CPUs from the Intel® Core™ Ultra line, the NanoCOM-MTU represents makes a big statement in a small form factor. AAEON, a leading provider of Computer-on-Modules, has today announced the NanoCOM-MTU, a COM Express Type 10 CPU Module powered by Intel® Core™ Ultra processors. Available […]
AAEON Release the World’s Smallest 13th Gen Intel Core-Powered Single Board
https://www.electronics-lab.com/aaeon-release-the-worlds-smallest-13th-gen-intel-core-powered-single-board/
At just 86mm x 55mm, the de next-RAP8 continues AAEON’s run of producing record-breaking single-board computers with embedded Intel technology. In another breakthrough in single-board computing, AAEON has released the de next-RAP8, the world’s smallest board featuring embedded 13th Generation Intel® Core™ Processors, measuring just 3.31” x 2.17” (84mm x 55mm). Available with a choice […]
AAEON Introduces Two Credit Card-Sized Wide Temperature Developer Boards
https://www.electronics-lab.com/aaeon-introduces-two-credit-card-sized-wide-temperature-developer-boards/
The UP TWL offers no-frills development while the UP TWLS features a slimmer design for compact, more IoT-focused applications. AAEON’s UP brand today announced the release of two new developer boards based on the new Intel® Core™ 3 processor platform (formerly Twin Lake), the UP TWL and UP TWLS. Those familiar with the UP 710S, […]