MEMS-based “sonar on a silicon chip” ultrasonic time-of-flight sensors
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MEMS-based “sonar on a silicon chip” ultrasonic time-of-flight sensors

TDK Corporation’s announces the immediate worldwide availability of the Chirp CH-101 MEMS-based ultrasonic Time-of-Flight (ToF) sensor. This ToF sensor utilizes a tiny ultrasonic transducer chip to send out a pulse of ultrasound and then listen for echoes returning from targets in the...

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