Tag: Intrinsyc

Intrinsyc Technologies announced the Open-Q 845 µSOM (micro System on Module) and Development Kit, to be available in the fourth quarter of 2019. The Open-Q 845 µSOM is the latest product in the evolution of Intrinsyc’s µSOM computing module series. It is an ultra-compact (50 mm x...

Designed for use in Advanced Robotics and Drones, Premium Camera Applications, Artificial Intelligence Platforms, and other Cutting-edge IoT Devices. Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of...

High-performance edge computing module for use in a variety of consumer and industrial IoT Devices Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of Things (IoT) products, today announced the availability...

Designed for next-gen home hub products requiring advanced audio and multi-mode wireless capabilities, including Wi-Fi, Bluetooth, BLE, and Zigbee. Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of Things...

Designed for use in 4K Cameras, Gaming, Digital Signage, and other Consumer and Industrial IoT Devices. Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of Things (IoT) products, today announced the...

Qualcomm announced back in April its QCS605 SoC, calling it "the first 10nm FinFET fabricated SoC, built for the Internet of Things." The octa-core Arm SoC is available in an Intrinsyc Open-Q 605 SBC with full development kit, including a 12V power supply which is available for...