Qualcomm SDA845 SoC-Based Module Targets Drone Designs
Intrinsyc Technologies announced the Open-Q 845 µSOM (micro System on Module) and Development Kit, to be available in the fourth quarter of 2019. The Open-Q 845 µSOM is the latest product in the evolution of Intrinsyc’s µSOM computing module series. It is an ultra-compact (50 mm x 25 mm), production-ready embedded module, well suited for powering the most advanced robotics, drones, cameras and embedded IoT devices requiring the latest on-device AI powers. Featuring the Qualcomm SDA845 system on chip (SoC) from Qualcomm Technologies, the 845 µSOM integrates many new features and capabilities in the same small form-factor:
- Higher performing Octa-core CPU – up to 2.6 GHz on Gold cores
- New hardware-based security layers for vault-like defense
- Third generation Qualcomm AI platform for immersive, on-device intelligence
- Four camera ports with flexible configurations supports up to 7 cameras
- New camera architecture for cinema grade video capture
- DisplayPort 4K60 via USB Type-C with USB super-speed data concurrency
- Additional USB3.1 port for device connectivity while using DisplayPort
- Gen3 PCIe interface.
This new hardware platform will be supported by your choice of full-featured Android 9 or Yocto Linux operating systems, with plans for offering Android 10 by Q2 next year. The Android 9 operating system will be shipped on the development kit and is a starting point for evaluation of the SOM and to kick-start your product development. If you prefer a Linux OS, that will be available to download from Intrinsyc and program onto your development kit. Full software documentation will also be included with purchase of the development kit.