Qualcomm SDA845 SoC-Based Module Targets Drone Designs

Intrinsyc Technologies announced the Open-Q 845 µSOM (micro System on Module) and Development Kit, to be available in the fourth quarter of 2019. The Open-Q 845 µSOM is the latest product in the evolution of Intrinsyc’s µSOM computing module series. It is an ultra-compact (50 mm x 25 mm), production-ready embedded module, well suited for powering the most advanced robotics, drones, cameras and embedded IoT devices requiring the latest on-device AI powers. Featuring the Qualcomm SDA845 system on chip (SoC) from Qualcomm Technologies, the 845 µSOM integrates many new features and capabilities in the same small form-factor:

• Higher performing Octa-core CPU – up to 2.6 GHz on Gold cores
• New hardware-based security layers for vault-like defense
• Third generation Qualcomm AI platform for immersive, on-device intelligence
• Four camera ports with flexible configurations supports up to 7 cameras
• New camera architecture for cinema grade video capture
• DisplayPort 4K60 via USB Type-C with USB super-speed data concurrency
• Additional USB3.1 port for device connectivity while using DisplayPort
• Gen3 PCIe interface.

This new hardware platform will be supported by your choice of full-featured Android 9 or Yocto Linux operating systems, with plans for offering Android 10 by Q2 next year. The Android 9 operating system will be shipped on the development kit and is a starting point for evaluation of the SOM and to kick-start your product development. If you prefer a Linux OS, that will be available to download from Intrinsyc and program onto your development kit. Full software documentation will also be included with purchase of the development kit.

more: www.intrinsyc.com

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