3D printed liquid cooled heatsinks cool down TO-247 transistors

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https://www.electronics-lab.com/3d-printed-liquid-cooled-heatsinks-cool-down-to-247-transistors/

Standard Transistor Cooler Made by 3D-printing using SLM (Selective Laser Melting) A very effective way to dissipate the high heat flux densities of electronic power modules or power devices with high power density is the use of micro-coolers or micro-channel heat sinks made by SML. These active small cooling elements can transmit up to 1000 […]

CoolSiC™ MOSFET 650 V family offers best reliability and performance to even more applications

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https://www.electronics-lab.com/coolsic-mosfet-650-v-family-offers-best-reliability-performance-even-applications/

Infineon Technologies AG continues to expand its comprehensive silicon carbide (SiC) product portfolio with 650 V devices. With the newly launched CoolSiC™ MOSFETs Infineon is addressing the growing demand for energy efficiency, power density, and robustness in a wide range of applications. Amongst them are server, telecom and industrial SMPS, solar energy systems, energy storage […]