Exploring Eagle CAD ULPs #3 – Teardrops.ULP Make A Teardrop Shape Connection With Pads and Vias

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https://www.electronics-lab.com/exploring-eagle-cad-ulps-3-teardrops-ulp-make-teardrop-shape-connection-pads-vias/

Welcome to the third post of the “Exploring Eagle CAD ULPs” series. Every week we will publish a new post about one useful ULP in Eagle CAD. “ULP” User Language Program is a plain text file which is written in a C­-like syntax and can be used to access the EAGLE data structures and to […]

Making PCB Vias using conductive ink

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https://www.electronics-lab.com/making-pcb-vias-using-conductive-ink/

Here’s an alternative method for making PCB vias using conductive ink from Diyouware: We developed an alternative method for making PCB vias through-hole using our robot. As you probably know the traditional DIY method consists in threading a wire through the holes and then soldering it and then cutting it off. For example, if we […]