Georgia Institute of Technology managed to cool FPGA trasistors using water, they announced:
Using microfluidic passages cut directly into the backsides of production field-programmable gate array (FPGA) devices, Georgia Institute of Technology researchers are putting liquid cooling right where it’s needed the most – a few hundred microns away from where the transistors are operating.
Combined with connection technology that operates through structures in the cooling passages, the new technologies could allow development of denser and more powerful integrated electronic systems that would no longer require heat sinks or cooling fans on top of the integrated circuits. Working with popular 28-nanometer FPGA devices made by Altera Corp., the researchers have demonstrated a monolithically-cooled chip that can operate at temperatures more than 60 percent below those of similar air-cooled chips.
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