Congatec Targets Low-Power Edge AI With Entry-Level COM Express Module
The new conga-TC300 COM is based on Intel Core Series 3 processors, offering up to 41 TOPS within a 12 W to 28 W TDP envelope for cost-sensitive industrial edge applications.
Congatec has announced the conga-TC300, a COM Express Compact Type 6 module based on Intel Core Series 3 processors. The module is positioned as an upgrade path for embedded designs previously running on Intel Atom or Celeron platforms that now require dedicated AI inferencing capabilities without a significant increase in power budget.
Processor Architecture and AI Performance
The Intel Core Series 3 processors at the heart of the conga-TC300 use a performance hybrid architecture consisting of two Performance cores (P-cores) and four Low Power Efficient cores (LP E-cores). This combination allows the module to balance responsiveness and efficiency depending on workload demands.
Congatec’s new conga-TC300 is a COM Express compact computer-on-module powered by the Intel Core Series 3 processor. Image used courtesy of Congatec
What differentiates this module from its predecessors is the inclusion of dedicated AI accelerators at multiple levels. The CPU itself contributes up to 5 TOPS through Intel 18A process improvements, while a dedicated NPU 5.0, present on selected SKUs, adds up to 18 TOPS for low-power inferencing tasks. Intel Xe3 graphics cores, also capable of up to 18 TOPS via XMX matrix engines, round out the compute stack.
The aggregate figure reaches 41 TOPS across the CPU, NPU, and GPU, all within a TDP range of 12 W to 28 W, with a 15 W base. The three available processor variants, including the Intel Core 7 350, Core 5 320, and Core 3 305, all share the same 2+4 core configuration, differing primarily in turbo frequency and GPU execution unit count. The Core 7 350 and Core 5 320 each feature 32 GPU execution units, while the Core 3 305 provides 16.
Connectivity and I/O
The conga-TC300 supports up to 64 GB of DDR5 via a single SO-DIMM socket running at speeds up to 6400 MT/s, with optional in-band ECC (IBECC) for applications with higher reliability requirements. Up to 512 GB of onboard UFS 3.1 storage is available as an option.
On the networking side, a 2.5 GbE interface is provided via the Intel i226 Ethernet controller, with TSN support on select variants, a consideration for designs targeting deterministic industrial communications. Up to eight PCIe lanes are configurable, with four native Gen4 lanes and an additional four Gen3 lanes available via an optional PCIe switch. This flexibility enables direct connection of peripherals such as fieldbus adapters or wireless modules without requiring a switch on the carrier board.
The conga-TC300 delivers low-power, cost-efficient AI performance to edge AI applications. Image used courtesy of Adobe Stock
Display output options include up to two DDI ports (shared with USB4), one LVDS port, or one eDP port. The full I/O complement includes up to 2x USB4, 4x USB 3.2, 4x USB 2.0, 2x SATA, 2x UART, GPIOs, GP SPI, eSPI, SM Bus, HDA audio, and I2C. Security is handled by an onboard TPM 2.0, and the sixth-generation Congatec Board Controller provides multi-stage watchdog functionality, hardware health monitoring, power-loss protection, and POST code redirection. The module measures 95 × 95 mm and operates across a commercial-grade temperature range of 0°C to 60°C.
Software and Ecosystem Support
The conga-TC300 supports Windows 11, Windows 11 IoT Enterprise, and Linux. As part of Congatec’s aReady.COM program, the modules can be supplied preconfigured with ctrlX OS, Ubuntu Pro, or KontronOS. The aReady.VT option integrates the conga-zones hypervisor, enabling workload consolidation, running real-time control, HMI, AI, and IoT gateway functions concurrently on a single module. The aReady.IOT software building blocks extend this with cloud connectivity and remote management capabilities.
Evaluation and application carrier boards, cooling solutions (including passive coolers and heatspreaders in both bore-hole and threaded standoff configurations), and design-in services are available from Congatec to support development.
The conga-TC300 is well-suited to embedded designs that need to incorporate local AI functions, such as voice and gesture recognition, object detection, or LLM-based inference, within tight power and cost constraints. Target applications include AGVs and AMRs, intelligent HMIs, patient data monitoring systems, surveillance endpoints, and retail checkout terminals. With a stated availability of up to ten years, the module also addresses the longevity requirements typical of industrial and medical embedded platforms.
