Qualcomm Dragonwing Development Kit Offers 24 TOPS Edge AI

Qualcomm Dragonwing Development Kit Offers 24 TOPS Edge AI

Thundercomm’s Qualcomm Dragonwing Development Kit features the Q-7790 SoC, 24 TOPS AI performance, Android/Linux support, and r...


Luckfox Aura Brings RV1126B AI Processing to Embedded Linux Projects

Luckfox Aura Brings RV1126B AI Processing to Embedded Linux Projects

The Luckfox Aura combines a quad-core RV1126B SoC, 3 TOPS NPU, Wi-Fi 6, dual CSI, and 4K video support for AI and edge computing...


AAEON Unveils BOXER-6407-TWL Fanless Mini PC with Intel Twin Lake SoC

AAEON Unveils BOXER-6407-TWL Fanless Mini PC with Intel Twin Lake SoC

A compact industrial system with DDR5 support, dual LAN ports, and wide-temperature operation targets automation, signage, and...


Romu is a Tiny RP2354A USB Development Board for Embedded Projects

Romu is a Tiny RP2354A USB Development Board for Embedded Projects

A keychain-sized USB Type-A board built around the RP2354A MCU with MicroPython support, RGB LED, capacitive touch input, and...


Geniatech AIM-M-K AI Accelerator Brings 40 TOPS AI to M.2 Edge Systems

Geniatech AIM-M-K AI Accelerator Brings 40 TOPS AI to M.2 Edge Systems

Geniatech AIM-M-K is an M.2 AI accelerator with NXP Ara-240 NPU, 40 TOPS performance, and support for LLMs and vision AI...


ESP32-P4-Pi Board Combines Wi-Fi 6, Ethernet, and Pi Form Factor

ESP32-P4-Pi Board Combines Wi-Fi 6, Ethernet, and Pi Form Factor

VIEWE’s dual-chip ESP32-P4 and ESP32-C6 platform targets HMI, edge AI, multimedia, and industrial IoT applications with rich m...


Congatec Targets Low-Power Edge AI With Entry-Level COM Express Module

Congatec Targets Low-Power Edge AI With Entry-Level COM Express Module

The new conga-TC300 COM is based on Intel Core Series 3 processors, offering up to 41 TOPS within a 12 W to 28 W TDP envelope for...


AAEON Introduces an “All-in-One” AI-Powered Robotics Development System

AAEON Introduces an “All-in-One” AI-Powered Robotics Development System

The CEXD-INTRBL open robotic system utilizes Intel Core Ultra (Series 3) architecture and delivers up to 180 TOPS AI performance,...


Forlinx FAI-ARA240-M M.2 AI Accelerator Delivers 40 eTOPS

Forlinx FAI-ARA240-M M.2 AI Accelerator Delivers 40 eTOPS

Forlinx Embedded launches an M.2 AI module with NXP Ara240, 16GB RAM, and PCIe Gen4, enabling high-throughput edge AI and...


Everspin’s UNISYST MRAM Combines Code and Data Storage for Embedded Systems

Everspin’s UNISYST MRAM Combines Code and Data Storage for Embedded Systems

The new UNISYST MRAM family unifies code and data storage in a single device, offering up to 2 Gb density, 400 MB/s reads, and a...


SECO Unveils MediaTek Genio 360/360P-Based Cost-Efficient Edge AI SOMs

SECO Unveils MediaTek Genio 360/360P-Based Cost-Efficient Edge AI SOMs

The SOM-Trizeps-X-Genio360/360P Edge AI SOMs are built on MediaTek's 6 nm Genio 360/360P IoT processors, offering cost-effective...


AMD Announces Ryzen AI Embedded P100 and X100 Series Processors

AMD Announces Ryzen AI Embedded P100 and X100 Series Processors

The new processors combine Zen 5 CPU cores, AMD RDNA 3.5 GPU, and AMD XDNA 2 NPU to power AI-driven automotive and industrial...