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Menlo Micro's MM5800 Brings Micromechanical Switching to 70 GHz
Υouyeetoo R1 v3.0 Combines Rockchip RK3588S SBC and NFC Support
bUniProbe – Open Source Wireless Multi-Protocol Hardware Debugger Tool
SIGLENT's New AWG Combines RF Synthesis, IQ Modulation, and Sequencing
Mastering the Curve: Layout Strategies for FPC Bend Radius and Reliability
From Hearing to Understanding: MEMS Microphones as a Foundation of Robotic Perception
How to Clean a Soldering Iron Tip Without Ruining It
Why PVC Remains a Go-To Material for Electronics Enclosures and Equipment Mounts
Analog To Digital Conversion - Sampling and Quantization
Positive Feedback in Electronic Circuits
Temperature Sensors
Magnetostatic Fields In Material Bodies
3-Wire Electret Microphone Pre-Amplifier
12W Step Up DC-DC Converter using MAX1771
Sound to Light Color Shield for OLEDUINO v2
Multipurpose Motor Driver Shield for OLEDUINO v2
An Introduction to RF Theory, Practices, and Components: The Ins and Outs of RF
The Growing Decentralization of Power Grids
Thundercomm’s Qualcomm Dragonwing Development Kit features the Q-7790 SoC, 24 TOPS AI performance, Android/Linux support, and r...
The Luckfox Aura combines a quad-core RV1126B SoC, 3 TOPS NPU, Wi-Fi 6, dual CSI, and 4K video support for AI and edge computing...
A compact industrial system with DDR5 support, dual LAN ports, and wide-temperature operation targets automation, signage, and...
A keychain-sized USB Type-A board built around the RP2354A MCU with MicroPython support, RGB LED, capacitive touch input, and...
Geniatech AIM-M-K is an M.2 AI accelerator with NXP Ara-240 NPU, 40 TOPS performance, and support for LLMs and vision AI...
VIEWE’s dual-chip ESP32-P4 and ESP32-C6 platform targets HMI, edge AI, multimedia, and industrial IoT applications with rich m...
The new conga-TC300 COM is based on Intel Core Series 3 processors, offering up to 41 TOPS within a 12 W to 28 W TDP envelope for...
The CEXD-INTRBL open robotic system utilizes Intel Core Ultra (Series 3) architecture and delivers up to 180 TOPS AI performance,...
Forlinx Embedded launches an M.2 AI module with NXP Ara240, 16GB RAM, and PCIe Gen4, enabling high-throughput edge AI and...
The new UNISYST MRAM family unifies code and data storage in a single device, offering up to 2 Gb density, 400 MB/s reads, and a...
The SOM-Trizeps-X-Genio360/360P Edge AI SOMs are built on MediaTek's 6 nm Genio 360/360P IoT processors, offering cost-effective...
The new processors combine Zen 5 CPU cores, AMD RDNA 3.5 GPU, and AMD XDNA 2 NPU to power AI-driven automotive and industrial...