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Roundup: New Digital Isolator Launches Target Industrial and Automotive Systems
u-blox ALMA-B2 Brings Bluetooth 6.0 and Edge AI to Low-Power IoT
Catalina GW9200 Embedded SBC Brings NXP i.MX95, 10GbE, and Edge AI
KYOCERA AVX Launches Web-Based Antenna Selection Tool
Mastering the Curve: Layout Strategies for FPC Bend Radius and Reliability
From Hearing to Understanding: MEMS Microphones as a Foundation of Robotic Perception
How to Clean a Soldering Iron Tip Without Ruining It
Why PVC Remains a Go-To Material for Electronics Enclosures and Equipment Mounts
Analog To Digital Conversion - Sampling and Quantization
Positive Feedback in Electronic Circuits
Temperature Sensors
Magnetostatic Fields In Material Bodies
High Current Half Bridge with Over-Current Shutdown
3-Wire Electret Microphone Pre-Amplifier
12W Step Up DC-DC Converter using MAX1771
Sound to Light Color Shield for OLEDUINO v2
An Introduction to RF Theory, Practices, and Components: The Ins and Outs of RF
The Growing Decentralization of Power Grids
The Ti125 packs 123K logic elements, sub-milliwatt static power, 2.5 Gbps MIPI I/O, and hardware SEU correction into a footprint...
Powered by Snapdragon 8cx Gen 3, the Dragon Q8B combines dual 2.5GbE, PCIe expansion, Wi-Fi 7 support, and up to 32GB RAM for...
Thundercomm’s Qualcomm Dragonwing Development Kit features the Q-7790 SoC, 24 TOPS AI performance, Android/Linux support, and r...
The Luckfox Aura combines a quad-core RV1126B SoC, 3 TOPS NPU, Wi-Fi 6, dual CSI, and 4K video support for AI and edge computing...
A compact industrial system with DDR5 support, dual LAN ports, and wide-temperature operation targets automation, signage, and...
A keychain-sized USB Type-A board built around the RP2354A MCU with MicroPython support, RGB LED, capacitive touch input, and...
Geniatech AIM-M-K is an M.2 AI accelerator with NXP Ara-240 NPU, 40 TOPS performance, and support for LLMs and vision AI...
VIEWE’s dual-chip ESP32-P4 and ESP32-C6 platform targets HMI, edge AI, multimedia, and industrial IoT applications with rich m...
The new conga-TC300 COM is based on Intel Core Series 3 processors, offering up to 41 TOPS within a 12 W to 28 W TDP envelope for...
The CEXD-INTRBL open robotic system utilizes Intel Core Ultra (Series 3) architecture and delivers up to 180 TOPS AI performance,...
Forlinx Embedded launches an M.2 AI module with NXP Ara240, 16GB RAM, and PCIe Gen4, enabling high-throughput edge AI and...
The new UNISYST MRAM family unifies code and data storage in a single device, offering up to 2 Gb density, 400 MB/s reads, and a...