ADLINK DLAP-701 Edge AI Platform Powered by NVIDIA Jetson Thor
https://www.electronics-lab.com/adlink-dlap-701-edge-ai-platform-powered-by-nvidia-jetson-thor/
ADLINK’s DLAP-701 uses NVIDIA Jetson Thor with up to 128GB LPDDR5X, high-speed I/O, and industrial design for robotics, vision, and AI workloads.
Meet ADLINK’s cExpress-R8: The Compact Solution to Demanding and Diverse Industrial Workloads
https://www.electronics-lab.com/meet-adlinks-cexpress-r8-the-compact-solution-to-demanding-and-diverse-industrial-workloads/
AMD Ryzen™ Embedded 8000 Series with RDNA™ 3 and XDNA™ Delivers Up to 40 TOPS for Edge AI Summary: Built on AMD Ryzen™ Embedded 8000 Series processors for powerhouse performance. Deploy 8-core, 16-thread processing with AMD RDNA™ 3 graphics for accelerated multitasking and immersive visuals. Achieve up to 40 TOPS of AI inferencing performance with […]
ADLINK Launches Intel® Core™ Ultra COM-HPC Mini with Powerful Computing Performance
https://www.electronics-lab.com/adlink-launches-intel-core-ultra-com-hpc-mini-with-powerful-computing-performance/
COM-HPC-mMTL: 14-Core Intel® Core™ Ultra Processor with Integrated ARC GPU+NPU and 16x PCIe. Ultra-Power Performance, Perfectly Sized to Fit Any Space Summary: Powered by the Intel® Core™ Ultra architecture with up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for high-performance AI acceleration, combining ultra-power with energy efficiency. 64GB LPDDR5x memory soldered […]
ADLINK Launches OSM-MTK510 – High-Performance, Ultra-Low Power, Rugged, Compact Solution
https://www.electronics-lab.com/adlink-launches-osm-mtk510-high-performance-ultra-low-power-rugged-compact-solution/
OSM-MTK510 Module: A 6-Core, 5W COM Solution Built for Extreme Ruggedness and 10-Year Longevity ADLINK Technology Inc., a global leader in edge computing, announces the launch of the new OSM-MTK510. It is an OSM R1.1 Size-L with a 662 BGA module powered by the MediaTek Genio 510 series processor. The newest OSM solution is engineered […]
ADLINK I-Pi SMARC is an Amston Lake Fanless Dev Kit with 8GB LPDDR5, and dual Raspberry Pi GPIO headers
https://www.electronics-lab.com/adlink-i-pi-smarc-is-an-amston-lake-fanless-dev-kit-wiht-8gb-lpddr5-and-dual-raspberry-pi-gpio-headers/
ADLINK has recently released the I-Pi SMARC, an Amston Lake Fanless Dev Kit designed for industrial and IoT applications. This new dev kit features a SMARC 2.1-compliant module with an Intel Atom x7433RE quad-core SoC, 8GB LPDDR5 memory, and up to 256GB eMMC storage. On the other hand, the carrier board features dual 2.5GbE TSN-capable […]
ADLINK releases Intel Core Ultra-powered COM Express Module with integrated CPU+GPU+NPU providing up to 50% in power saving
https://www.electronics-lab.com/adlink-releases-intel-core-ultra-powered-com-express-module-with-integrated-cpugpunpu-providing-up-to-50-in-power-saving/
ADLINK Technology Inc., a global leader in edge computing, announces the launch of its cExpress-MTL, a Compact size COM Express Type 6 module powered by the latest Intel Core Ultra processor. Featuring Intel modular architecture that integrates CPU, GPU, and NPU all-in-one for optimized performance and efficiency, the module provides up to 8 GPU Xe-cores […]
ADLINK introduces COM-Express Type 7 module with the best performance per watt in its class
https://www.electronics-lab.com/adlink-introduces-com-express-type-7-module-with-the-best-performance-per-watt-in-its-class/
Powered by AMD® Ryzen™ Embedded V3000, the module features up to 8 cores at 15W, 45W, integrated 2x10G Ethernet, with extreme temperature options for various networking use cases Summary: ADLINK brings 8 cores at 15W, 45W TDP in its latest COM Express Basic size Type 7 module —Express VR7 — delivering the best performance per […]
ADLINK’s COM-HPC module powered by 13th Gen Intel® Core processor offers up to i9, 24 cores, and 36MB cache at 65W TDP
https://www.electronics-lab.com/adlinks-com-hpc-module-powered-by-13th-gen-intel-core-processor-offers-up-to-i9-24-cores-and-36mb-cache-at-65w-tdp/
Featuring 1 x16 PCIe Gen5 and up to 16 Performance-cores plus 8 Efficient-cores, the module is ideal for compute-intensive use cases such as test & measurement, medical imaging, and industrial AI Summary: The ADLINK COM-HPC-cRLS Client type Size C module based on 13th Gen Intel® Core™ processor is available for order with: up to 13th […]
ADLINK launches MXM-AXe – a first discrete graphics MXM module powered by Intel Arc GPU1
https://www.electronics-lab.com/adlink-launches-mxm-axe-a-first-discrete-graphics-mxm-module-powered-by-intel-arc-gpu1/
ADLINK Technology Inc., a global leader in edge computing, introduces the first MXM (R3.1) Type A discrete graphics module based on Intel Arc GPU — the MXM-AXe. Harnessing Intel Arc’s hardware ray tracing, dedicated AI acceleration, and support for 4x 4K displays, the module enhances responsiveness, precision, and reliability for graphics-demanding, time-sensitive edge applications in […]
ADLINK releases its new AIoT SMARC module, a first based on MediaTek® SoC, featuring Genio 1200 with an 8-core CPU + 5-core GPU
https://www.electronics-lab.com/adlink-releases-its-new-aiot-smarc-module-a-first-based-on-mediatek-soc-featuring-genio-1200-with-an-8-core-cpu-5-core-gpu/
Summary: The ADLINK’s new module is of SMARC 2.1 specification, short size, based on the MediaTek® Genio 1200 processor, and designed to drive AIoT, 4K graphics applications at the edge It features an octa-core (4x Cortex-A78 + 4x Cortex-A55) CPU at 2.2GHz, a 5-core GPU for advanced 3D graphics, and an integrated APU (AI Processor […]