ADLINK Unveils COM-HPC Mini Module for Edge AI Applications

ADLINK COM-HPC-mPTL Mini Computer-on-module

ADLINK has introduced the COM-HPC Mini Module, a compact computer-on-module based on Intel Core Ultra Series 3 “Panther Lake” processors. Designed for edge AI, robotics, machine vision, industrial automation, and embedded computing, the module delivers high AI performance in a 95 × 70 mm COM-HPC Mini form factor.

The COM-HPC Mini Module supports Intel Panther Lake-H processors up to the Intel Core Ultra X7 358H, featuring 16 hybrid CPU cores, Intel Arc Xe3 graphics, and an integrated NPU capable of delivering up to 50 TOPS. Combined with GPU acceleration reaching up to 122 TOPS, the platform offers as much as 180 TOPS of AI performance for demanding edge workloads. The module also integrates up to 64GB LPDDR5x memory, optional onboard NVMe SSD storage, and high-speed PCIe Gen5 and USB4 connectivity.

ADLINK COM-HPC-mPTL (Top)

ADLINK COM-HPC-mPTL Specifications:

• SoC: Intel Core Ultra Series 3 “Panther Lake-H” processors
  • Intel Core Ultra X7 358H, 16-core (4P+8E+4LPE), up to 4.8GHz, 12-core Xe3 GPU (122 TOPS), 50 TOPS NPU, 25W PBP
  • Intel Core Ultra 7 356H, 16-core (4P+8E+4LPE), up to 4.7GHz, 4-core Xe3 GPU (40 TOPS), 50 TOPS NPU, 25W PBP
  • Intel Core Ultra 5 325, 8-core (4P+0E+4LPE), up to 4.5GHz, 4-core Xe3 GPU (40 TOPS), 47 TOPS NPU, 25W PBP
• Memory: Up to 64GB LPDDR5x memory at up to 8533 MT/s
• Storage:
  • Optional onboard NVMe SSD
  • PCIe Gen5 x2 interface
• Networking:
  • 2x Intel I226 2.5GbE controllers
  • Optional TSN support
• Camera: Optional 2x MIPI-CSI FFC connectors
• Display:
  • 2x DDI ports supporting DP 1.4a or HDMI 2.1
  • 3x USB4 ports with DisplayPort Alt Mode
  • eDP 1.4b
  • Support for up to four independent displays
• USB:
  • 3x USB4 with DisplayPort Alt Mode
  • 4x USB 3.2 Gen2x1 (10Gbps)
  • 4x USB 2.0
• Expansion:
  • Up to 16 PCIe lanes
  • 8x PCIe Gen5 lanes
  • 6x PCIe Gen4 lanes
  • SMBus, 2x I2C, GP_SPI, Boot_SPI, and eSPI
  • 12x GPIO with interrupt support
  • 2x UART with console redirection
• Security: Infineon TPM 2.0 (SPI)
• Management:
  • SEMA board controller
  • Voltage and current monitoring
  • Power-sequence debugging
  • Watchdog timer and fan control
  • Event and forensic logging
• Debug Interface:
  • 40-pin FFC/FPC debug connector
  • Compatible with DB40-HPC debug module
  • BIOS
  • AMI UEFI BIOS
  • 32MB SPI flash
  • Optional dual BIOS support
• Power Input:
  • 12V ±5% AT mode
  • 8V to 20V single power rail
  • Wide-input support: 8.5V to 20V
• Operating Temperature:
  • Standard: 0°C to 60°C
  • Industrial: -40°C to 85°C
  • Humidity:
    • Operating: 5% to 90% RH
    • Storage: 5% to 95% RH
• Compliance:
  • IEC 60068-2-64
  • IEC 60068-2-27
  • MIL-STD-202F
• Form Factor:
  • COM-HPC Mini Rev. 1.3
  • 95 x 70 mm
  • 400-pin high-density board-to-board connector

ADLINK COM-HPC-mPTL (Bottom)

ADLINK supports Windows 11 IoT Enterprise LTSC and Ubuntu 24.04 LTS for the COM-HPC Mini Module. The company also offers VxWorks support for project-based deployments. Developers can evaluate the module with ADLINK’s COM-HPC Mini Base Carrier Board, which provides Ethernet, display outputs, PCIe expansion slots, audio interfaces, and multiple USB ports.

ADLINK lists the COM-HPC Mini Module as a preliminary product and has not disclosed pricing or availability details. Additional information, technical documentation, and ordering options can be found on the ADLINK product page. The company also offers optional heat spreaders and active cooling solutions for the module.

Images used courtesy of Adlink tech