Tag: Com
COM-HPC server modules have 80-core Ampere® Altra® Arm-based SoCs for embedded applications
The new COM-HPC Ampere® Altra® is a first-in-its-class power-efficient solution for high performance embedded edge applications. ADLINK Technology Inc., a global leader in edge computing, introduces the COM-HPC Ampere® Altra®, the world’s first 80-core COM-HPC server type module...
Continue ReadingSOM-5883 with 11th Gen. Intel® Core™ Processors Empower Breakthrough Performance and Next Gen. I/O Expansion
Advantech, a leading embedded and AIoT solutions provider, has released the new SOM-5883 Computer-on-Module for high-performance edge computing applications. SOM-5883 is a COM Express Basic Type6 Module, with integrated 11th Gen. Intel® Core™ processors (formally called Tiger...
Continue ReadingComputer-on-Modules target IoT gateway, AI edge computing
congatec – a leading vendor of embedded and edge computing technology – introduces 20 new Computer-on-Modules following the launch of Intel’s 11th generation Core processor for IoT. Featuring 11th Gen Intel Core vPro, Intel Xeon W-11000E, and Intel Celeron processors, the new...
Continue ReadingADLINK Launches First COM Express Module Featuring Intel® Core™, Xeon® and Celeron® 6000 processors
The Express-TL module with 11th Generation Intel processors is ideal for performance-demanding applications in embedded and industrial conditions ADLINK Technology Inc., a global leader in edge computing, today introduces its new Express-TL COM Express Type 6 module with Intel®...
Continue ReadingPCOM-B645VGL is COM Express Type 6 Compact Module Powered by Intel Atom x6000E Series Processor
Portwell, a world-leading innovator in the embedded computing market has introduced the PCOM-B645VGL, a new Type 6 compact COM Express module powered by robust Intel Atom x6000E Series (formerly Elkhart Lake platform) processor to meet the demands of critical real-time computing in...
Continue ReadingLow-power COM Express Module with AMD Ryzen™ Embedded V1000/R1000 SoC
IBASE Technology Inc., a leading provider of industrial motherboards and embedded solutions, announces the launch of the ET977 low-power COM Express Compact Type 6 modules, which are based on the AMD Ryzen™ Embedded SoC to enable next-generation embedded designs. The series...
Continue ReadingFirst COM-HPC and next-gen COM Express
congatec fuels launch of 11th Gen Intel® Core™ processors with two great new design options In parallel with the 11th Gen Intel® Core™ processor launch (code named “Tiger Lake”), congatec – a leading vendor of embedded computing technology – announces the...
Continue ReadingCOM Express Type 10 CPU Module Features Extended Temperature and ECC Support
IBASE has announced the new ET876 COM Express Type 10 CPU Module (R3.0) supporting Intel’s energy-efficient Atom™ Processor E3900 series, Intel® Celeron® Processor N3350 and Intel® Pentium® Processor N4200. It utilizes multi-core processor technology for high-performance...
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