ADLINK Launches First COM Express Module Featuring Intel® Core™, Xeon® and Celeron® 6000 processors
SBC-SiP-SoC-CoM

ADLINK Launches First COM Express Module Featuring Intel® Core™, Xeon® and Celeron® 6000 processors

The Express-TL module with 11th Generation Intel processors is ideal for performance-demanding applications in embedded and industrial conditions ADLINK Technology Inc., a global leader in edge computing, today introduces its new Express-TL COM Express Type 6 module with Intel®...

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PCOM-B645VGL is COM Express Type 6 Compact Module Powered by Intel Atom x6000E Series Processor
SBC-SiP-SoC-CoM

PCOM-B645VGL is COM Express Type 6 Compact Module Powered by Intel Atom x6000E Series Processor

Portwell, a world-leading innovator in the embedded computing market has introduced the PCOM-B645VGL, a new Type 6 compact COM Express module powered by robust Intel Atom x6000E Series (formerly Elkhart Lake platform) processor to meet the demands of critical real-time computing in...

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Low-power COM Express Module with AMD Ryzen™ Embedded V1000/R1000 SoC
SBC-SiP-SoC-CoM

Low-power COM Express Module with AMD Ryzen™ Embedded V1000/R1000 SoC

IBASE Technology Inc., a leading provider of industrial motherboards and embedded solutions, announces the launch of the ET977 low-power COM Express Compact Type 6 modules, which are based on the AMD Ryzen™ Embedded SoC to enable next-generation embedded designs. The series...

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First COM-HPC and next-gen COM Express
SBC-SiP-SoC-CoM

First COM-HPC and next-gen COM Express

congatec fuels launch of 11th Gen Intel® Core™ processors with two great new design options In parallel with the 11th Gen Intel® Core™ processor launch (code named “Tiger Lake”), congatec – a leading vendor of embedded computing technology – announces the...

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COM Express Type 10 CPU Module Features Extended Temperature and ECC Support
SBC-SiP-SoC-CoM

COM Express Type 10 CPU Module Features Extended Temperature and ECC Support

IBASE has announced the new ET876 COM Express Type 10 CPU Module (R3.0) supporting Intel’s energy-efficient Atom™ Processor E3900 series, Intel® Celeron® Processor N3350 and Intel® Pentium® Processor N4200. It utilizes multi-core processor technology for high-performance...

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AMD Ryzen based Congatec COM Express module for the industrial temperature range
SBC-SiP-SoC-CoM

AMD Ryzen based Congatec COM Express module for the industrial temperature range

congatec – a leading vendor of embedded computing technology – introduces its new conga-TR4 COM Express Type 6 module with AMD Ryzen Embedded V1000 Series processors for the industrial temperature range from -40°C to +85°C. It is available with optional burn-in & cold-soak...

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Linux-driven PicoCore™MX8MN module is tiny
SBC-SiP-SoC-CoM

Linux-driven PicoCore™MX8MN module is tiny

COM modules with NXP i.MX 8M Nano CPU High performance in a compact format Based on the NXP® i.MX 8M Nano applications processor, F&S Elektronik Systeme has developed an inexpensive CPU module (35x40mm) with many industrial interfaces and extensive software support. The...

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A new SMARC 2.0 module from Congatec with i.MX 8M Nano processor
SBC-SiP-SoC-CoM

A new SMARC 2.0 module from Congatec with i.MX 8M Nano processor

Congatec is introducing a new CoM, the Conga-SMX8-Nano that offers up to 4x ARM Cortex-A53 and 1x Cortex-M7 core along with 1,000's of different possible configurations. This SMARC 2.0 module based on NXP i.MX 8M Nano processor series can meet ultra-low-power requirements with...

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