Qualcomm SDA845 SoC-Based Module Targets Drone Designs

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https://www.electronics-lab.com/qualcomm-sda845-soc-based-module-targets-drone-designs/

Intrinsyc Technologies announced the Open-Q 845 µSOM (micro System on Module) and Development Kit, to be available in the fourth quarter of 2019. The Open-Q 845 µSOM is the latest product in the evolution of Intrinsyc’s µSOM computing module series. It is an ultra-compact (50 mm x 25 mm), production-ready embedded module, well suited for […]

Intrinsyc Announces New Premium-Tier System on Module based on Qualcomm Technologies’ SDA845 System on Chip

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https://www.electronics-lab.com/intrinsyc-announces-new-premium-tier-system-module-based-qualcomm-technologies-sda845-system-chip/

Designed for use in Advanced Robotics and Drones, Premium Camera Applications, Artificial Intelligence Platforms, and other Cutting-edge IoT Devices. Intrinsyc Technologies Corporation, a leading provider of solutions for the development and production of embedded and Internet of Things (IoT) products, today announced the Open-Q™ 845 µSOM (micro System on Module) and Development Kit, to be […]