Octavo Creates a 1GHz Computer That Fits into A 27x27mm SiP Package

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https://www.electronics-lab.com/octavo-creates-a-1ghz-computer-that-fits-into-a-27x27mm-sip-package/

The OSD335x C-SiP System-in-Package (SiP) developed by Octavo, is a concept package that is modeled on its previous Sitara AM335x based SiP by including up to 16GB eMMC, an oscillator along with 1GB DDR3, PMIC, LDO, and EEPROM. The OSD335x C-SiP, is the most consolidated System-In-Package (SiP) module ever made. Modeled like its predecessors, the […]

Octavo Systems Releases OSD3358-SM-RED Beaglebone Black Compatible Board

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https://www.electronics-lab.com/octavo-systems-releases-osd3358-sm-red-beaglebone-black-compatible-board/

Octavo Systems back in 2017 released their OSD335x-SM System-In-Package device, a powerful ARM Cortex®-A8 SIP-based package. The OSD335x-SM was a device of its class, measured at just 21mm x 21mm, and the OSD335x-SM is the smallest AM335x processor-based module on the market today that still allows complete access to all the AM335x device I/Os including PRUs. […]