3D silicon-integrated microcapacitors have unprecedented performance
https://www.electronics-lab.com/3d-silicon-integrated-microcapacitors-unprecedented-performance/
Picosun Group, global provider of leading AGILE ALD® (Atomic Layer Deposition) thin film coating solutions, reports record performance of silicon-integrated, three-dimensional deep trench microcapacitors manufactured using its ALD technology. Increasing efficiency and performance demands of portable and wearable electronics, along with their shrinking size in accordance with the Moore’s law, set new challenges to the […]
Inexpensive chip-based device may transform spectrometry
https://www.electronics-lab.com/inexpensive-chip-based-device-may-transform-spectrometry/
Tiny device could replace expensive lab-scale equipment for many applications. Spectrometers — devices that distinguish different wavelengths of light and are used to determine the chemical composition of everything from laboratory materials to distant stars — are large devices with six-figure price tags, and tend to be found in large university and industry labs or […]
Murata’s 3D Silicon Capacitors
https://www.electronics-lab.com/muratas-3d-silicon-capacitors/
Murata high-density silicon capacitors are developed with a semiconductor MOS process and are using the third dimension to substantially increase the capacitor surface and thus its capacitance without increasing the capacitor footprint. Murata silicon technology is based on a monolithic structure embedded in a monocristalline substrate (single MIM and multi MIM – Metal Insulator Metal). […]
Nano-sandwiches in Electronics Significantly Reduce Risk of Overheating
https://www.electronics-lab.com/nano-sandwiches-electronics-reduce-risk-overheating-significantly/
A new study about “Reduction of overheating of 2D materials” published in the Journal of Advanced Materials. The work put behind the study is credited to the researchers at the University of Illinois at Chicago College of Engineering. By joining together two-dimensional materials used in nanoelectronic devices between their three-dimensional silicon bases, they formed an ultrathin layer […]
Revolutionizing Electric Field Measuring Techniques
https://www.electronics-lab.com/revolutionizing-electric-field-measuring-techniques/
Nowadays, electrical fields are being used not only in electrical engineering, but also for industrial, weather forecasting, safety, and medical applications. As a result, the need for a precise electric field strength measurement device has become increasingly high, and many investigations have devoted their resources to creating such device. TU Wien has developed a small […]
Transistors- The 70-year-old invention that changed the world
https://www.electronics-lab.com/transistors-70-year-old-invention-changed-world/
Its been 70 years since the fundamental building block of electronics was created, and it has been getting smaller, and better since then. The invention that won the Nobel prize for John Bardeen, Walter Brattain, and William Shockley in 1956 revolutionized electronics and made it into the IEEE milestone list. Before 1947 computers used vacuum […]
New Ultrathin Semiconductors Can Make More Efficient and Ten Times Smaller Transistors Than Silicon
https://www.electronics-lab.com/new-ultrathin-semiconductors-can-make-efficient-ten-times-smaller-transistors-silicon/
The researchers at Stanford University have discovered two ultrathin semiconductors – hafnium diselenide and zirconium diselenide. They share or even exceed some of the very important characteristics of silicon. Silicon has a great property of forming “rust” or silicon dioxide (SiO2) by reacting with oxygen. As the SiO2 acts as an insulator, chip manufacturers implement this property […]
Prosthetics Feeling Is Now Possible With This Implantable Chip By Imec
https://www.electronics-lab.com/prosthetics-feeling-now-possible-implantable-chip-imec/
Imec, the world-leading research and innovation hub in nano-electronics and digital technology, announced last month its prototype implantable chip that aims to give patients more intuitive control over their arm prosthetics. The thin-silicon chip is said to be world’s first for electrode density. Creating a closed-loop system for future-generation haptic prosthetics technology is the aim […]
What is Embedded FPGA — Known as eFPGA
https://www.electronics-lab.com/embedded-fpga-known-efpga/
Today’s market requirements change faster than the typical development time for a new device or the ability of designers of SoCs to know. To solve this problem, FPGAs/MCUs are used so developers can change the configuration/firmware later. As known, MCU IP is static and you can’t change the silicon design (RTL design) after fabrication. FPGA […]
Open Source Meets Hardware: Open Processor Core
https://www.electronics-lab.com/open-source-meets-hardware-open-processor-core/
SiFive, the first fabless provider of customized, open-source-enabled semiconductors, had recently announced the availability of its Freedom Everywhere 310 (FE310) system on a chip (SoC), the industry’s first commercially available SoC based on the free and open RISC-V instruction set architecture. The Freedom E310 (FE310) is the first member of the Freedom Everywhere family of […]