Würth Elektronik Launches Heat Sink Portfolio for Power Electronics and ICs

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https://www.electronics-lab.com/wurth-elektronik-launches-heat-sink-portfolio-for-power-electronics-and-ics/

The new heat sinks target THT-TO packages and flat-surface ICs, with pre-coated thermal interface material variants available from stock.

AOS Launches Low- and Medium-Voltage MOSFETs With Double-Sided Cooling

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https://www.electronics-lab.com/aos-launches-low-and-medium-voltage-mosfets-with-double-sided-cooling/

The new AONC40202 25 V and AONC68816 80 V MOSFETs are available in a DFN 3.3×3.3 source-down packaging with double-sided cooling and a center-gate layout for AI servers and data centers.

Bourns Releases Thermal Jumper Chip Series for Thermal Management

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https://www.electronics-lab.com/bourns-releases-thermal-jumper-chip-series-for-thermal-management/

The BTJ series brings together a high 170 W/mK thermal conductivity with high insulation resistance, targeting heat detection and dissipation in mobile equipment and electronics.