Bourns Releases Thermal Jumper Chip Series for Thermal Management
The BTJ series brings together a high 170 W/mK thermal conductivity with high insulation resistance, targeting heat detection and dissipation in mobile equipment and electronics.
Bourns has introduced the BTJ series thermal jumper chips, which combine aluminum nitride’s 170 W/mK thermal conductivity with electrical insulation in surface-mount packages. Available in six EIA standard sizes, the components address thermal management challenges in power electronics and RF circuits.
BTJ Series Thermal Jumper Chips
The BTJ thermal jumper chip series uses aluminum nitride as its thermal transfer medium, delivering 170 W/mK thermal conductivity while maintaining electrical isolation between circuit nodes. This dual functionality enables the components to occupy the space between heat-generating elements and thermal-sensing devices, thereby improving temperature measurement accuracy without introducing electrical coupling.
Bourns’ BTJ series of thermal jumper chips for thermal dissipation. Image used courtesy of Bourns
High Thermal Conductivity With Insulation
The series offers six package sizes spanning EIA standard footprints from 0508 to 2512. Thermal resistance ranges from 4°C/W to 20°C/W, with corresponding thermal conductance values from 50 mW/°C to 250 mW/°C. Parasitic capacitance remains low, ranging from 0.07 pF to 0.26 pF, which minimizes impact on high-frequency signal paths. Dielectric withstand voltage scales with package dimensions, ranging from greater than 1.5 kVac RMS to exceeding 5.0 kVac RMS for the 2512 size. The operating temperature range is -55°C to 155°C, addressing industrial requirements.
The BTJ series devices are moisture-sensitive level 1 and require no special handling during assembly. Reliability testing includes 1000 thermal cycles between -55°C and 155°C, terminal strength testing per AEC-Q200-006, and mechanical bending verification. Reflow soldering follows standard profiles with a 260°C peak temperature for up to 30 seconds. The series meets RoHS requirements and qualifies as halogen-free, with bromine and chlorine content below the specified thresholds.
The BTJ series is suitable for a wide range of thermal-dissipation applications in electronics and mobile devices. Image used courtesy of Adobe Stock
Heat Management Solutions
Package selection involves trade-offs between thermal performance and board area. Larger 0612 and 1225 configurations provide 4°C/W thermal resistance with 250 mW/°C conductance, while compact 0603 packages minimize footprint at reduced thermal capacity. Low capacitance specifications prevent signal-integrity degradation in RF applications, while high dielectric strength meets voltage requirements in GaN power amplifiers.
The BTJ series addresses thermal management in switching power supplies, DC-DC converters, and RF amplifiers, where concentrated heat generation leads to localized temperature rises. In GaN power stages, the components enable thermal coupling to heatsinks while maintaining electrical isolation from high-voltage nodes. The series also targets pin and laser diode circuits that require precise thermal control, as well as data server applications where component density demands effective heat dissipation within constrained board space.
Bourns’ Thermal Jumper Chip Series is a smart innovation for efficient thermal management, offering compact design and reliable heat control for modern electronic applications.