Ultra-thin, high thermal conductivity substrate integrates ESD protection

Ultra-thin, high thermal conductivity substrate integrates ESD protection

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Clemens Valens @ elektormagazine.com discuss about a new IC substrate. He writes:

A new, ultra-thin ceramic substrate with an ESD strength of up to 25 kV – more than three times higher than the standard 8 kV of state-of-the-art Zener diodes – also features a high thermal conductivity of 22 W/mK. This is three times better than that of conventional carriers, even though the substrate is significantly slimmer. The new technology is especially well-suited for LED applications where the number and density of LEDs per unit continues to grow.

Ultra-thin, high thermal conductivity substrate integrates ESD protection – [Link]

Mike is the founder and editor of Electronics-Lab.com, an electronics engineering community/news and project sharing platform. He studied Electronics and Physics and enjoys everything that has moving electrons and fun. His interests lying on solar cells, microcontrollers and switchmode power supplies. Feel free to reach him for feedback, random tips or just to say hello :-)

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