Electronics Lab

CES 2026: Intel Panther Lake-H Powers Vecow TGS-2000 Stackable Edge AI PCs

Vecow’s compact TGS-2000 series uses Intel Core Ultra Series 3 Panther Lake-H CPUs to deliver up to 100 TOPS AI performance for industrial edge applications.



 Vecow TGS-2000 Panther Lake-H Edge AI PCs

Vecow TGS-2000 series Panther Lake-H based Stackable Edge AI PCs

At CES 2026, Vecow released the TGS-2000 series of ultra-compact, stackable Edge AI PCs based on the Intel Core Ultra Series 3 “Panther Lake-H” processors, which is a direct upgrade of the Meteor Lake-powered TGS-1000 Series. The platform targets edge inference, smart infrastructure, and automation workloads, and comes in fanless and actively cooled variants, with an optional MXM GPU model for heavier graphics and AI acceleration.

The TGS-2000 series comes in two SQUs with a 16-core Intel Core Ultra 9 386H or 12-core Core Ultra 5 336H SoCs, both are built around Intel’s 18A(1.8nm) process and combine Xe3 Arc GPU, and Intel AI Boost NPU for up to 100 TOPS of AI performance (with Panther Lake-H capable of up to 180 TOPS at the platform level). Key features include up to 128GB DDR5-6400 memory, PCIe 4.0 NVMe storage, triple-display support (HDMI 2.1 and USB-C DP), dual 2.5GbE networking, rich USB I/O, and multiple M.2 expansion options for Wi-Fi, Bluetooth, 4G/5G, and storage. The stackable design supports modular I/O expansion (GPIO, isolated DIO, serial, USB, LAN, and cellular), while the industrial-grade design adds wide operating temperatures, shock/vibration compliance, watchdog, and hardware monitoring.

Vecow TGS-2000 Series Specifications:

  • Processors: Intel Core Ultra Series 3 Panther Lake-H:
    • Core Ultra 9 386H
      • 4× P-cores, 8× E-cores, 4× LP-E cores, total 16 cores
      • Up to 4.9 GHz boost
      • Intel Arc Xe3 GPU (4 cores, up to 40 TOPS)
      • Intel AI Boost NPU up to 50 TOPS
      • Up to 100 TOPS platform AI performance
      • 25 W PBP / 80 W MTP
    • Core Ultra 5 336H
      • 4× P-cores, 4× E-cores, 4× LP-E cores, total 12 cores
      • Up to 4.6 GHz boost
      • Intel Arc Xe3 GPU (up to 37 TOPS)
      • Intel AI Boost NPU up to 47 TOPS
      • 25 W PBP / 80 W MTP
    • Both are Intel 18A (1.8 nm-class)
  • Chipset: ITE IT8659E Super I/O
  • Memory: Up to 128 GB DDR5-6400 via 2× SO-DIMM slots
  • Storage: 1× M.2 Key-M (2280, PCIe 4.0 x4) for NVMe SSD
  • Video Output:
    • 2× HDMI 2.1 (up to 4096×2304 @ 60 Hz)
    • DisplayPort 1.4 via USB-C (up to 3840×2160 @ 60 Hz)
    • 2× DP 1.4 via MXM GPU card (TGS-2500F only)
  • Audio:
    • Realtek ALC888S-VD
    • 7.1-channel HD audio
    • Mic-in and Line-out
  • Networking:
    • 2× 2.5 GbE RJ45 (Intel I226)
    • One port supports iAMT
  • USB:
    • 1× USB-C 3.2 Gen 2×2 (20 Gbps)
    • 2× USB-A 3.2 Gen 2
    • 2× USB-A 2.0
  • Expansion:
    • M.2 Key-E (2230) for Wi-Fi / Bluetooth
    • M.2 Key-B (3042/3052) with SIM for 4G/5G
    • Stackable expansion connector (TGS-100 series compatible)
      • GPIO, isolated DIO
      • RS-232/422/485
      • Isolated COM
      • USB 3.0
      • Additional LAN
      • 4G module
    • MXM graphics card slot
  • System management:
    • Watchdog timer (1–255 s/min)
    • Hardware monitoring with thermal throttling
    • AMI BIOS
  • Power input
    • TGS-2000 / TGS-2000F: 12–24 V DC (terminal block)
    • TGS-2500F: 24 V DC only
  • Dimensions:
    • TGS-2000 (fanless): 117 × 120 × 64 mm, 1.8 kg
    • TGS-2000F (fan-cooled): 117 × 120 × 38 mm, 0.9 kg
    • TGS-2500F (MXM): 117 × 120 × 114 mm, 2.3 kg
  • Operating temperature:
    • Fanless: –25 °C to +45 °C (with airflow)
    • Fan-cooled / MXM: –25 °C to +55 °C
  • Storage temperature: –40 °C to +85 °C
  • Humidity: 5–95% RH, non-condensing
  • Shock: IEC 61373
  • Vibration: EN50155 rolling stock
  • EMC: CE, FCC, ICES, EN50155, EN50121-3-2
  • Mounting: DIN-rail and VESA mounting support

TGS-2000F Compact – Includes a FAN

TGS-2500F Supports Independent MXM Graphics

TGS-2000 Fanless Version with Passive Heat Decipator

The platform supports Windows 11, Windows 10 LTSC, and Linux. It uses an AMI BIOS and supports Intel OpenVINO, allowing AI applications to run and be optimized across the CPU, integrated Arc GPU, and the Intel AI Boost NPU.

The system is available with optional accessories for installation and expansion, including certified DDR5 memory, a 120 W power adapter, stackable expansion modules, DIN-rail and VESA mounting kits, M.2 storage, and optional 5G, 4G/GPS, and Wi-Fi/Bluetooth connectivity modules.

Pricing has not been disclosed, and interested customers need to contact Vecow directly for quotes; more details are available on the TGS-2000, TGS-2000F, and TGS-2500F product pages and the official press release.

Images used courtesy of Vecow

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