Intel Modular Architecture Blueprint: Enhancing Repairability with LPCAMM, M.2, and Thunderbolt Post-Channel Modularity

Intel has shared its perspective on incorporating modular PC design into electronics to support right-to-repair policies and improve repairability in computers. The company’s reference designs for a new type of modular computer could pave the way for easily repairable laptops and mini-PCs, helping reduce electronic waste (e-waste) by allowing users to replace key components like the motherboard, display, and user-facing port modules via M.2 or FPC add-ons.

Unlike the traditional monolithic approach, this modular PC architecture enables greater flexibility, making it easier to upgrade and repair systems while extending their lifespan.

The goals of modular PC design include:

• Reducing environmental impact by minimizing the carbon footprint
• Creating scalable systems that adapt to changing user needs
• Supporting right-to-repair with field-replaceable components
• Enabling seamless upgrades without requiring full device replacement
• Optimizing costs through module reuse in manufacturing
• Simplifying product SKU management and accelerating time to market

Framework’s fully modular laptops, which can be easily serviced and upgraded with just a screwdriver, are already making a significant impact on the industry.

Intel has categorized the modular PC concept into three architectures: Premium Modular PC, Entry/Mainstream Modular PC, and Desktop Modular PC.

Intel proposes a setup that breaks a laptop motherboard into three pieces (instead of the usual all-in-one approach), with sub-boards on the left and right (where your USB and HDMI ports go) that can be customized by the manufacturer to support their particular I/O needs. That means that the central motherboard (including the processor and cooling setup) could be upgraded separately from the left and right components.

The core idea behind modular laptops is that users or technicians can easily replace or upgrade individual components without needing to swap out the entire device or send it back to the factory.

Intel’s Modular Architecture Blueprint takes this concept even further than Framework’s laptops, introducing a reference design that incorporates modularity from manufacturing to field repairs and user upgrades.

The proposed design features separate components for the new LPCAMM memory standard, along with commonly upgraded parts like Wi-Fi and SSDs, which can be swapped using M.2 cards. According to Intel, these designs enable seamless scaling for laptops with screen sizes ranging from 14 to 16 inches, offering configurations with fanless, single-fan, or dual-fan cooling.

The I/O boards for Premium Modular designs are compatible across fanless Thin & Light (10W) and fanned models (20W single fan, 30W dual fan, Wi-Fi-only SKU). Designed for usability, repairability, and serviceability, Intel’s approach features removable CPUs, SODIMM memory, and GPUs on slide rails. For mini-PCs, hot-swappable M.2 modules enable easy GPU and processor upgrades in a plug-and-play fashion.

Intel also introduces subsystem-level replaceable modules, like Type-C connectors on FPC and M.2 PCBs, reducing repair costs and simplifying fixes. While modular mini-PCs are easier to design than modular laptops, both extend lifespan and reduce e-waste with upgradable, repairable components.

Thunderbolt post-channel modularity offers a potential solution for improving repairability by adding another layer of modularity.

If Intel successfully delivers these reference designs to computer makers, it could lead to more modular laptops and mini-PCs, streamline manufacturing, reduce costs through module reuse, and simplify SKU management while accelerating time to market.

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