ADLINK presents Edge server-class COM-HPC Server Type and COM Express Type 7 Modules powered by the latest Intel® Xeon® D processors
https://www.electronics-lab.com/adlink-presents-edge-server-class-com-hpc-server-type-and-com-express-type-7-modules-powered-by-the-latest-intel-xeon-d-processors/
ADLINK’s new COM-HPC Server Type and COM Express Type 7 Modules boost real-time computing with integrated high-speed Ethernet and industrial-grade reliability & longevity ADLINK Technology Inc., a global leader in edge computing, introduces its latest Intel® Xeon® D-based Computer-on-Modules (COMs), available in two form factors – COM-HPC Server Type and COM Express Type 7. Powered […]
ADLINK launches COM-HPC Client Type and COM Express Type 6 Modules with 12th Gen Intel® Core™ processors
https://www.electronics-lab.com/adlink-launches-com-hpc-client-type-and-com-express-type-6-modules-with-12th-gen-intel-core-processors/
Breakthrough Intel® Core™ technology with ADLINK Computer-on-Modules allow for hybrid architecture performance and a wide variety of deployment scenarios with superior performance ADLINK Technology Inc., a global leader in edge computing, introduces the world’s first 12th Gen Intel Core processor-based Computer-on-Modules (COMs), available in two form factors – COM-HPC Client Type and COM Express Type […]
ADLINK releases its first SMARC module based on Qualcomm QRB5165
https://www.electronics-lab.com/adlink-releases-its-first-smarc-module-based-on-qualcomm-qrb5165/
ADLINK releases its first SMARC module based on Qualcomm QRB5165 enabling high-performance robots and drones at low power Integrated IoT technologies provide on-device AI capabilities at the edge. ADLINK Technology Inc., a global leader in edge computing, released the LEC-RB5 SMARC module –its first SMARC AI-on-Module based on a Qualcomm Technologies, Inc. processor. The Qualcomm […]
COM-HPC server modules have 80-core Ampere® Altra® Arm-based SoCs for embedded applications
https://www.electronics-lab.com/com-hpc-server-modules-have-80-core-ampere-altra-arm-based-socs-for-embedded-applications/
The new COM-HPC Ampere® Altra® is a first-in-its-class power-efficient solution for high performance embedded edge applications. ADLINK Technology Inc., a global leader in edge computing, introduces the COM-HPC Ampere® Altra®, the world’s first 80-core COM-HPC server type module that eliminates power-performance limitations. The new server type module targets edge platforms that reliably and predictably process […]
ADLINK Launches First COM Express Module Featuring Intel® Core™, Xeon® and Celeron® 6000 processors
https://www.electronics-lab.com/adlink-launches-first-com-express-module-featuring-intel-core-xeon-and-celeron-6000-processors/
The Express-TL module with 11th Generation Intel processors is ideal for performance-demanding applications in embedded and industrial conditions ADLINK Technology Inc., a global leader in edge computing, today introduces its new Express-TL COM Express Type 6 module with Intel® Core™, Xeon® W and Celeron® 6000 processors and octa-core (8-core) performance. Intel® UHD Graphics and Intel® […]
ADLINK’s CM5-P1000 Features NVIDIA Quadro P1000 GPU
https://www.electronics-lab.com/adlinks-cm5-p1000-features-nvidia-quadro-p1000-gpu/
We saw ADLINK releasing the industry’s first embedded MXM graphic modules based on NVIDIA’s Turing architecture, to accelerate edge AI inference in SWaP-constrained applications. Now, ADLINK Technology has come up with CM5-P1000, the world’s first COTS PC/104 module to feature NVIDIA’s Quadro P1000 GPU. It primarily targets AI-enabled mission-critical applications. Measuring just 116 x 96 […]
NVIDIA Jetson Xavier NX Integrated Industry’s First Industrial AI Smart Camera
https://www.electronics-lab.com/nvidia-jetson-xavier-nx-integrated-industrys-first-industrial-ai-smart-camera/
If you are working on edge-AI devices then you would’ve considered buying NVIDIA Jetson Xavier NX, which is a best-in-class deep learning-accelerating module claimed to be the world’s smallest supercomputer that was released last year. With the increasing implementation of AI-edge devices with this powerful SOM, we have several additional hardware coming to market to […]
ADLINK Releases Industry-first Embedded MXM Graphics Modules on NVIDIA Turing™ Architecture
https://www.electronics-lab.com/adlink-releases-industry-first-embedded-mxm-graphics-modules-on-nvidia-turing-architecture/
Embedded MXM graphics modules based on Turing architecture for edge AI ADLINK Technology Inc. a global leader in edge computing, today introduced the industry’s first embedded MXM-based graphics modules based on NVIDIA’s Turing architecture, to accelerate edge AI inference in SWaP-constrained applications. GPUs are increasingly used to provide AI inferencing at the edge, where size, […]
ADLINK Launches SMARC AI-on-Module to Drive Industrial AI at the Edge
https://www.electronics-lab.com/adlink-launches-smarc-ai-on-module-to-drive-industrial-ai-at-the-edge/
A future-proof, open standard formfactor of rugged industrial grade design with up to 15 years longevity and software portability through NXP® Semiconductors eIQ™ AI SDK ADLINK Technology Inc., a global leader in edge computing, has launched the LEC-IMX8MP SMARC module, the first SMARC rev. 2.1 AI-on-Module (AIoM) that uses NXP’s next-generation i.MX 8M Plus SoC […]
The new E variants of Intel Tiger Lake lineup and Adlink cExpress-TL
https://www.electronics-lab.com/the-new-e-variants-of-intel-tiger-lake-lineup-and-adlink-cexpress-tl/
Intel has launched three embedded 11th gen, 10nm SuperFin fabricated Tiger Lake ULP3 “E” processors, keeping in mind the growing need for embedded applications. These new processors join with the earlier released nine Tiger Lake U-series ULP3 and lower-power Y-series ULP4 chips. Taking benefit from these new chips Adlink has now released a COM Express Compact […]