Congatec Announces Edge Computing Modules and Full-Custom Design Service
https://www.electronics-lab.com/congatec-announces-edge-computing-modules-and-full-custom-design-service/
At Embedded World 2026, Congatec unveiled new variants of its conga-TCRP1 COM Express module, launched the new conga-HPC/cBLS COM-HPC module, and debuted a custom design service, aReady.YOURS.
GigaDevice Unveils Motor Control MCU and Expands 1.2 V SPI NOR Flash to 256 Mb
https://www.electronics-lab.com/gigadevice-unveils-motor-control-mcu-and-expands-1-2-v-spi-nor-flash-to-256-mb/
The new GD32M531 series MCU is purpose-built for motor control applications, while the expanded GD25UF series 1.2 V SPI NOR Flash targets advanced AI computing.
Everspin’s UNISYST MRAM Combines Code and Data Storage for Embedded Systems
https://www.electronics-lab.com/everspins-unisyst-mram-combines-code-and-data-storage-for-embedded-systems/
The new UNISYST MRAM family unifies code and data storage in a single device, offering up to 2 Gb density, 400 MB/s reads, and a migration path from its existing PERSYST platform.
Bluetooth LE HDT: Rohde & Schwarz and Realtek Showcase Test Solution
https://www.electronics-lab.com/bluetooth-le-hdt-rohde-schwarz-and-realtek-showcase-test-solution/
The two companies have validated what they say is the industry's “first” test solution for Bluetooth LE high data throughput (HDT), a feature that pushes the maximum data rate from 2 Mbps to 7.5 Mbps.
SECO Unveils MediaTek Genio 360/360P-Based Cost-Efficient Edge AI SOMs
https://www.electronics-lab.com/seco-unveils-mediatek-genio-360-360p-based-cost-efficient-edge-ai-soms/
The SOM-Trizeps-X-Genio360/360P Edge AI SOMs are built on MediaTek's 6 nm Genio 360/360P IoT processors, offering cost-effective industrial-grade operation in a compact 67.6 × 36.7 mm SODIMM module.
From Maker to Production tools by Arrow Electronics
https://www.electronics-lab.com/maker-production-tools-arrow-electronics/
Arrow Electronics, a global provider of products, services, and solutions to industrial and commercial users of electronic components and enterprise computing solutions, is now joining the Embedded World 2017 exhibition and conference. Embedded world is the trade fair for the security for electronic systems and distributed intelligence, started on 14 March 2017 until 16 March in Nuremberg, Germany. […]