SECO Unveils MediaTek Genio 360/360P-Based Cost-Efficient Edge AI SOMs

SECO is expanding its Trizeps SODIMM System-on-Module (SOM) family with the SOM-Trizeps-X-Genio360 and its pin-compatible sibling, the SOM-Trizeps-X-Genio360P.  The modules are built around MediaTek’s recently launched Genio 360 and Genio 360P IoT processors.

SECO has designed the modules for engineers working on industrial automation, smart devices, and edge AI applications who need a compact, power-efficient, and cost-manageable compute platform with a well-defined long-term support roadmap. The company will unveil both modules at Embedded World 2026 (March 10–12, Nuremberg).

SECO has built its SOM-Trizeps-X-Genio360/360P in a compact 67.6 mm × 36.7 mm form factor. Image used courtesy of SECO

MediaTek Genio 360/360P IoT Processors

MediaTek’s Genio 360 and 360P are 6 nm, value-tier IoT processors designed to deliver practical edge AI capabilities for cost-sensitive embedded applications. Their integrated NPU delivers over 8 TOPS of AI performance, allowing local inference for tasks ranging from image classification to generative AI—no cloud connection required. The two SoCs are electrically pin-to-pin compatible, providing developers with a straightforward upgrade or substitution path without hardware redesign.

SECO’s SOM-Trizeps-X-Genio360/360P modules are built on MediaTek’s Genio 360 and Genio 360P IoT processors. Image used courtesy of MediaTek

SECO’s SOM-Trizeps-X-Genio360/360P

The SOM-Trizeps-X-Genio360/360P SOMs measure 67.6 mm × 36.7 mm and connect to carrier boards via a standard low-cost SODIMM connector, a deliberate choice to keep both the BOM cost and mechanical complexity down in price-sensitive designs. Typical power consumption sits below 5 W, which simplifies thermal management in fanless or sealed enclosures.

The module supports a temperature range of -40°C to 85°C (industrial version), making it suitable for deployment in environments where commercial-grade components would fall short. SECO also emphasizes long-term pin and software compatibility across the Trizeps family, which matters for designs with extended production lifetimes.

On the connectivity and display side, the Genio 360 platform supports 4K display output, camera interfaces, and a range of industrial I/O, positioning the module for applications such as advanced HMIs, handheld devices, smart appliances, and AI-enabled edge systems.

SECO’s Modular Vision Genio700 HMI is powered by its Clea software framework. Image used courtesy of SECO

HMI and Software Ecosystem

Alongside the new SOM, SECO will be showcasing its Modular Vision 15.6 Genio700, a 15.6-inch industrial HMI built on the higher-performance MediaTek Genio 700. At Embedded World, a live demo running on this platform will demonstrate face recognition, voice command processing, and sample inspection, all executing locally with low latency. The Genio 510-based Modular Vision variant offers an additional option for applications with tighter power or cost budgets.

Both the SOM and HMI product lines integrate with SECO’s Clea software framework, which handles AI model optimization, secure deployment, device management, and lifecycle monitoring. Developers can also draw on SECO’s Application Hub and Developer Center for pre-built AI and IoT applications targeting MediaTek platforms.