Congatec Announces Edge Computing Modules and Full-Custom Design Service
At Embedded World 2026, Congatec unveiled new variants of its conga-TCRP1 COM Express module, launched the new conga-HPC/cBLS COM-HPC module, and debuted a custom design service, aReady.YOURS.
At Embedded World 2026, Congatec introduced a pair of embedded computing modules and formalized a new customization service for OEM customers. The three announcements — the conga-TCRP1 COM Express module, the conga-HPC/cBLS COM-HPC module, and the aReady.YOURS program — all span a range of performance tiers and deployment models.

The conga-TCRP1 COM Express compact module is now available with eight, ten, or twelve CPU cores. Image used courtesy of Congatec
conga-TCRP1: Scalable AMD COM Express Compact Module
The conga-TCRP1 is a COM Express 3.1 Type 6 Compact module based on the AMD Ryzen AI Embedded P100 series. Congatec’s release adds six new variants to the existing lineup, bringing the total processor count to ten options spanning 4 to 12 CPU cores and 2 to 16 GPU compute units. The processors use AMD’s 4-nm “Zen 5” and “Zen 5c” architectures, with boost frequencies reaching 5.1 GHz at the top of the stack.
The integrated XDNA2 NPU delivers up to 50 TOPS of AI compute, and the Radeon RDNA 3.5 GPU supports up to four independent displays. Memory scales to 96 GB of DDR5-5600 RAM with optional ECC. Connectivity includes up to eight configurable PCIe Gen4 lanes, PEG x4 Gen4, four USB 3.2 Gen2 ports, and 2.5 GbE. Storage options include an onboard NVMe SSD up to 512 GB or dual SATA 6 Gb/s drives. All variants cover a configurable TDP window of 15 W to 54 W, with standard (0°C to 60°C) and industrial (-40°C to 85°C) temperature grades available for each configuration.
The module targets compute-intensive applications such as mobile medical imaging, AI-based machine vision, and smart city infrastructure, as well as rugged mission computers. The wide TDP range allows designers to tune the performance-per-watt profile without swapping modules, simplifying product family development under SWaP-C constraints.

The conga-HPC/cBLCS COM-HPC client platform. Image used courtesy of Congatec
conga-HPC/cBLS: Intel P-Core–Only COM-HPC Client Module
The conga-HPC/cBLS is a COM-HPC Client Size C module built around Intel Core Series 2 processors (codename: Bartlett Lake-S). Unlike hybrid-core configurations, this lineup uses only high-performance P-cores (up to 12) with the stated goal of simplifying the development of fully deterministic, low-latency systems. Single-core turbo frequencies reach 5.7 GHz on the top-tier Core 9 273PE, and all three SKUs carry a 65 W base power rating.
The module supports up to 192 GB of ECC-capable memory across four SO-DIMM sockets and provides 42 PCIe lanes for high-bandwidth expansion, including AI accelerator cards. The integrated Intel UHD Graphics (up to 32 execution units) supports Intel Deep Learning Boost and Vector Neural Network Instructions (VNNI) for edge AI inference workloads. Connectivity includes dual 2.5 GbE, four USB 3.2 and four USB 2.0 ports, SATA, UART, GPIO, I2C, and HD audio.
The socketed LGA processor design is intended to support field upgrades, and Congatec positions it as an alternative to traditional motherboards for designs that require regular technology refresh cycles. Target markets include test and measurement, medical imaging, smart grid systems, robotics, and industrial process automation.
The aReady.YOURS is a custom embedded computing solution for OEMs seeking full-custom designs. Video used courtesy of Congatec
aReady.YOURS: A Formal Path to Full-Custom Embedded Designs
The third announcement takes a different shape. aReady.YOURS is a customization and software integration service, backed by a newly established Customer Application Center, that extends Congatec’s existing aReady hardware and software portfolio into fully tailored OEM platform delivery.
The service is built around what congatec calls COM-carrier fusion: using validated COM modules and existing carrier board layouts as the foundation, then applying only the customer-specific adaptations needed for a given design. The intent is to preserve design reliability and keep development cycles short. Software integration — including preconfigured and licensed operating systems, the conga-zones hypervisor from aReady.VT, and IIoT connectivity stacks from aReady.IOT — can be included in the delivered platform.
Four service tiers are described: custom hardware and software design, requirements engineering consultation, technical support and debugging, and extended lifecycle services including material stockpiling and license production. Series production is handled through congatec’s manufacturing partnership with Kontron, under a regional “local-for-local” strategy.
The service is positioned at OEMs that need full-custom designs for cost or efficiency reasons, but want to reduce the entry overhead typically associated with starting a design from scratch.
Supported Software Across All Three Announcements
All three products support Windows 11, Windows 11 IoT Enterprise, Linux, and Ubuntu Pro. The aReady.COM option allows modules to be preconfigured with ctrlX OS, Ubuntu Pro, or Kontron OS, while aReady.VT adds hypervisor-on-module support for workload consolidation. The software stack consistency across the two hardware modules makes the conga-TCRP1 and conga-HPC/cBLS straightforward options for teams already working within the congatec ecosystem.