Photoacoustic spectroscopy (PAS) miniaturizes CO2 sensor XENSIV™ PAS210
https://www.electronics-lab.com/photoacoustic-spectroscopy-pas-miniaturizes-co2-sensor-xensiv-pas210/
City dwellers often spend a large amount of their time indoors, either in an office, at school, or simply at home. Urbanized spaces, however, tend to trap and develop bad air quality as they get more insulated for energy efficiency purposes. The concentration of CO 2 is an indicator for bad air quality. Today´s market solutions for […]
New XENSIV KP276 absolute pressure sensor series covers a range of 10 kPa to 400 kPa
https://www.electronics-lab.com/new-xensiv-kp276-absolute-pressure-sensor-series-covers-range-10-kpa-400-kpa/
Infineon Technologies’ new XENSIV KP276 absolute pressure sensor series covers a range of 10 kPa to 400 kPa, is highly accurate and has fast measurement and communication. The new digital sensor is intended for applications such as the measurement of manifold air pressure (MAP) in aspirated or turbo (Turbo MAP) diesel and gasoline engines as […]
World’s first monolithically integrated linear Hall sensor for ASIL D systems
https://www.electronics-lab.com/worlds-first-monolithically-integrated-linear-hall-sensor-asil-d-systems/
Infineon Technologies will launch a monolithically integrated linear Hall sensor which was developed entirely according to the safety standard ISO26262 for automotive applications. With just one device, the XENSIV TLE4999I3 enables the development of fault-tolerant systems that have to meet the highest level of functional safety (ASIL D). These include, for example, electric steering systems, […]
LG and Infineon to introduce LG G8ThinQ with front-facing Time-of-Flight camera
https://www.electronics-lab.com/lg-infineon-introduce-lg-g8thinq-front-facing-time-flight-camera/
With Infineon’s REAL3™ Image Sensor Chip, LG Offers Enhanced Security and Depth Measuring Selfie Camera LG Electronics and Infineon Technologies AG have teamed up to introduce leading edge Time-of-Flight (ToF) technology to smartphone selfie photo lovers world over. Infineon’s REAL3™ image sensor chip will play a key role in the front-facing camera of the upcoming […]
Linear LED controller ICs target dimmable lighting applications
https://www.electronics-lab.com/linear-led-controller-ics-target-dimmable-lighting-applications/
Two linear LED controller ICs have been added to the BCR portfolio, by Infineon Technologies. The BCR601 has voltage feedback to the primary side (also known as active headroom control or AHC), for cost effective and power efficiency LED driver applications. The BCR602 targets dimmable LED applications such as light engines, modules and strips. It […]
CIPOS™ Micro IPMs are qualified for harsh environments
https://www.electronics-lab.com/cipos-micro-ipms-qualified-harsh-environments/
600V intelligent power modules (IPMs) from Infineon make up the CIPOS Micro IPMs. They are qualified for harsh humid environments, passing 1000 hours of high voltage, high temperature and high humidity reverse bias (HV H3TRB) stress testing. This makes the energy-efficient IPM suitable for power appliance motor drives particularly in circulator hydronic pumps, drain pumps […]
Infineon claims industry’s first true 1000A voltage regulator for AI
https://www.electronics-lab.com/infineon-claims-industrys-first-true-1000a-voltage-regulator-ai/
Adding to its high current system chipset portfolio, Infineon claims to offer the industry’s first 16-phase digital PWM multiphase controller. The XDPE132G5C extends the existing portfolio which enables currents of 500 to 1000A and above for next generation CPUs, GPUs, FPGA and ASICs used in artificial intelligence (AI) and 5G datacomms applications. It has been […]
40V OptiMOS MOSFET family is optimized for synchronous rectification
https://www.electronics-lab.com/40v-optimos-mosfet-family-optimized-synchronous-rectification/
Based on Infineon’s thin wafer technology, a family of 40V MOSFETs are claimed to enable “significant performance benefits” and will cover a wide voltage range. The OptiMOS 6 family has been optimized for synchronous rectification in switch mode power supplies (SMPS) for servers, desktop PCs, wireless chargers, quick chargers and ORing circuits. They deliver a […]
REAL3™ Time-of-Flight image sensor: fourth generation with HVGA resolution
https://www.electronics-lab.com/real3-time-flight-image-sensor-fourth-generation-hvga-resolution/
Infineon Technologies AG is presenting the fourth generation of its REAL3™ image sensor IRS2771C at Mobile World Congress 2019 in Barcelona, Spain. The 3D Time-of-Flight (ToF) single chip is especially designed to meet the requirements of the mobile consumer device market and, in particular, demand for higher resolutions with small lenses. The wide range of […]
World’s first industrial-grade eSIM in miniaturized package
https://www.electronics-lab.com/worlds-first-industrial-grade-esim-miniaturized-package/
Machine-to-machine communication in the Internet of Things (IoT) requires reliable data collection and uninterrupted data transmission. For taking full advantage of the ubiquitous mobile networks, Infineon Technologies AG provides the world’s first industrial-grade embedded SIM (eSIM) in a miniature Wafer-level Chip-scale Package (WLCSP). Manufacturers of industrial machines and equipment ranging from vending machines to remote […]