CES 2026: Qualcomm Debuts Next-Gen Dragonwing Q-Series Processors
https://www.electronics-lab.com/ces-2026-qualcomm-debuts-next-gen-dragonwing-q-series-processors/
The new Dragonwing Q-8750 and Q-7790 processors feature on-device AI, enhanced multimedia capabilities, and high-performance processing to advance consumer and industrial edge devices.
Qualcomm Launches Industrial-Grade Processors for Intelligent Edge Solutions
https://www.electronics-lab.com/qualcomm-launches-industrial-grade-processors-for-intelligent-edge-solutions/
The Dragonwing IQ-X series processors provide “best-in-class” single and multithread performance for industrial PCs, PLCs, HMIs, and edge controllers in demanding industrial conditions.
Radxa Fogwise AIRbox Q900 Industrial Edge AI Box with 200 TOPS Power
https://www.electronics-lab.com/radxa-fogwise-airbox-q900-industrial-edge-ai-box-with-200-tops-power/
Compact industrial AI computer powered by Qualcomm IQ-9075 SoC, 36GB LPDDR5, 128GB UFS 3.1, dual 2.5GbE, and PCIe Gen4 SSD support for real-time robotics and vision workloads.
Qualcomm Dragonwing Q-6690: An SoC With Built-in UHF RFID
https://www.electronics-lab.com/qualcomm-dragonwing-q-6690-an-soc-with-built-in-uhf-rfid/
This new 4nm enterprise mobile processor delivers a complete, future-ready platform. It merges advanced connectivity and on-device AI for streamlined industrial devices.
Thundercomm unveils TurboX C6690 SoM at embedded world 2025
https://www.electronics-lab.com/thundercomm-unveils-turbox-c6690-som-at-embedded-world-2025/
Thundercomm, established in 2016 as a joint venture between Thundersoft and Qualcomm, specializes in advanced technologies such as AI, IoT, 5G, and cloud computing. The company recently introduced its latest system-on-module, the TurboX C6690. The compact module is built on the Qualcomm Dragonwing QCS6690 chip, which is manufactured using advanced 4nm process technology designed to […]