Arduino VENTUNO Q Brings 40-TOPS Edge AI and Real-Time Control
https://www.electronics-lab.com/arduino-ventuno-q-brings-40-tops-edge-ai-and-real-time-control/
The dual-processor board combines Dragonwing IQ8, STM32H5, Ubuntu, 16GB RAM, and extensive I/O for robotics, computer vision, and industrial AI.
Banana Pi BPI-AI2N SoM Features Renesas RZ/V2N SoC and 15 TOPS AI
https://www.electronics-lab.com/banana-pi-bpi-ai2n-som-features-renesas-rz-v2n-soc-and-15-tops-ai/
This compact 260-pin module combines quad-core Cortex-A55 processing with a powerful DRP-AI3 accelerator, robust networking, and an optional Jetson-style carrier board.
Dragonwing Q-2390 and IQ-2390 Bring AI and Real-Time Processing to IoT
https://www.electronics-lab.com/dragonwing-q-2390-and-iq-2390-bring-ai-and-real-time-processing-to-iot/
These new quad-core platforms bring machine vision, real-time control, and integrated connectivity to smart home appliances and rugged industrial automation systems.
Toradex Aquila IQ8 SoM Brings 40 TOPS Edge AI to Embedded Systems
https://www.electronics-lab.com/toradex-aquila-iq8-som-brings-40-tops-edge-ai-to-embedded-systems/
Powered by Qualcomm Dragonwing IQ-8275, the Aquila IQ8 targets robotics, computer vision, and industrial edge AI with advanced camera and connectivity options.
Radxa VMARC-Q9075 Packs 200 TOPS AI in an 82mm SMARC Module
https://www.electronics-lab.com/radxa-vmarc-q9075-packs-200-tops-ai-in-an-82mm-smarc-module/
Built around Qualcomm Dragonwing IQ-9075, the module combines 36GB LPDDR5, 128GB UFS, dual 2.5GbE, PCIe Gen4, and extensive I/O for edge AI.
Qualcomm Dragonwing Development Kit Offers 24 TOPS Edge AI
https://www.electronics-lab.com/qualcomm-dragonwing-development-kit-offers-24-tops-edge-ai/
Thundercomm’s Qualcomm Dragonwing Development Kit features the Q-7790 SoC, 24 TOPS AI performance, Android/Linux support, and rich I/O for edge AI deployments.
Qualcomm Launches Dragonwing MBM Series with 5G, Wi-Fi 7 and Multimedia Processing
https://www.electronics-lab.com/qualcomm-launches-dragonwing-mbm-series-combining-5g-and-wi-fi-7-connectivity-with-integrated-multimedia-processing/
The new broadband platforms integrate advanced cellular and wireless interfaces alongside dedicated hardware accelerators for multimedia and artificial intelligence.
Engicam SmarCore iQ6 SMARC Module Runs Qualcomm IQ-615 Processor With Adreno GPU
https://www.electronics-lab.com/engicam-smarcore-iq6-smarc-module-runs-qualcomm-iq-615-processor-with-adreno-gpu/
The SMARC 2.2 SmarCore iQ6 integrates Qualcomm’s IQ-615 processor, LPDDR4X memory, and multiple high-speed interfaces for industrial IoT, edge AI, and embedded computing applications.
Meet the Arduino VENTUNO Q: A “Dual-Brain” Architecture on a Single Board
https://www.electronics-lab.com/meet-the-arduino-ventuno-q-a-dual-brain-architecture-on-a-single-board/
The new board pairs a Dragonwing IQ8 series processor with an STM32H5 microcontroller, targeting edge AI, robotics, and motion control applications.
Innodisk Teams Up With Qualcomm, Develops COM-HPC Mini Module
https://www.electronics-lab.com/innodisk-teams-up-with-qualcomm-develops-com-hpc-mini-module/
The new EXMP-Q911 COM-HPC Mini module integrates Qualcomm's Dragonwing IQ-9075 processor, delivering 100 TOPS AI performance with wide-temperature operation for industrial edge applications.