Innodisk Teams Up With Qualcomm, Develops COM-HPC Mini Module
https://www.electronics-lab.com/innodisk-teams-up-with-qualcomm-develops-com-hpc-mini-module/
The new EXMP-Q911 COM-HPC Mini module integrates Qualcomm's Dragonwing IQ-9075 processor, delivering 100 TOPS AI performance with wide-temperature operation for industrial edge applications.
CES 2026: Qualcomm Debuts Next-Gen Dragonwing Q-Series Processors
https://www.electronics-lab.com/ces-2026-qualcomm-debuts-next-gen-dragonwing-q-series-processors/
The new Dragonwing Q-8750 and Q-7790 processors feature on-device AI, enhanced multimedia capabilities, and high-performance processing to advance consumer and industrial edge devices.
Qualcomm Launches Industrial-Grade Processors for Intelligent Edge Solutions
https://www.electronics-lab.com/qualcomm-launches-industrial-grade-processors-for-intelligent-edge-solutions/
The Dragonwing IQ-X series processors provide “best-in-class” single and multithread performance for industrial PCs, PLCs, HMIs, and edge controllers in demanding industrial conditions.
Qualcomm Introduces Satellite Support for Snapdragon Wearable Platforms
https://www.electronics-lab.com/qualcomm-introduces-satellite-support-for-snapdragon-wearable-platforms/
Qualcomm Technologies has integrated NB-NTN satellite support into its Snapdragon W5+ Gen 2 and W5 Gen 2 wearable platforms, enabling users to send and receive emergency messages in remote locations.