Energous and E-peas released energy harvesting kit that combines RF solution with power management IC
https://www.electronics-lab.com/energous-and-e-peas-released-energy-harvesting-kit-that-combines-rf-solution-with-power-management-ic/
The US-based wireless power and charging company, Energous in partnership with E-peas, has released its new wireless energy harvesting kit, which includes the 1W WattUp PowerBridge transmitter. The kit combines Energous’ radio frequency (RF) solution with E-peas’ power management IC (PMIC) technology to support smart homes and buildings, energy harvesting applications, asset trackers for retail […]
TB-RK1808M0 features Rockchip RK1808K SoC equipped with 3.0 TOPS AI Accelerator
https://www.electronics-lab.com/tb-rk1808m0-features-rockchip-rk1808k-soc-equipped-with-3-0-tops-ai-accelerator/
Since the Rockchip RK1808 SoC series was released about three years ago, this is the first time we will see the chip being used in the mPCIe form factor, despite always finding its way into several single-board computers. Toybrick TB-RK1808M0 offers a more recent version of the Rockchip RK1808 SoC (RK1808K) with 1GB RAM, and […]
Kneron KL720 AI SoCs
https://www.electronics-lab.com/kneron-kl720-ai-socs/
Kneron KL720 AI SoC (System on a Chip) offers an ideal balance of performance, power saving, and cost for hardware makers who are looking to benefit from on-device edge Artificial Intelligence (AI). Powered by Kneron’s Neural Processing Unit (NPU) that accelerates neural network models, the KL720 SoC makes possible endless AI applications for smart devices. The NPU […]
iWave launches the Zynq® UltraScale+™ RFSoC System on Module with ZU49/ZU39/ZU29
https://www.electronics-lab.com/iwave-launches-the-zynq-ultrascale-rfsoc-system-on-module-with-zu49-zu39-zu29/
iWave Systems is pleased to announce the Zynq UltraScale+ RFSoC System on Module. The SOM features the ZU49DR, and is compatible with the ZU39 and ZU29. The RFSoC Gen3 family is known to be a right fit for increasingly complex and performance-demanding RF applications such as 5G wireless, Digital RF front end, Aerospace, Defense, and […]
Meet SmartBond DA1470x Family of Bluetooth Low Energy ― the World’s Most Integrated SoC for Wireless Connectivity
https://www.electronics-lab.com/meet-smartbond-da1470x-family-of-bluetooth-low-energy-%e2%80%95-the-worlds-most-integrated-soc-for-wireless-connectivity/
Renesas Electronics Corporation, a leading global provider of microcontrollers, has combined its expertise in embedded processing, analog, power, and connectivity, to build the world’s most advanced integrated System-on-Chip family for wireless connectivity. The SmartBond™ DA1470x Family of Bluetooth® low energy (LE) solutions is an advanced chip that enables small form factor IoT product designs. With […]
First RISC-V-based SoC FPGA enters mass production with a smaller thermal footprint
https://www.electronics-lab.com/first-risc-v-based-soc-fpga-enters-mass-production-with-a-smaller-thermal-footprint/
Microchip Technology has announced the first system-on-chip Field Programmable Gate Array (FPGA), MPFS250T, based on the open-standard RISC-V instruction set architecture to enter mass production. The news comes as the continued adoption of PolarFire SoC FPGA and exponential growth for the Mi-V ecosystem streamline RISC-V adoption across various industrial, IoT, and edge computing embedded devices. […]
MediaTek’s first mmWave 5G chipset, the Dimensity 1050 offers seamless connectivity for 5G smartphones
https://www.electronics-lab.com/mediateks-first-mmwave-5g-chipset-the-dimensity-1050-offers-seamless-connectivity-for-5g-smartphones/
The Taiwan-based fabless semiconductor company MediaTek announces its first mmWave 5G chipset, the Dimensity 1050 system-on-chip. The mmWaves are used for high-speed broadband access, which will facilitate powering the next generation of 5G smartphones with seamless connectivity. The dual connection using mmWave and sub-6Hz enables the Dimensity 1050 to offer the speeds and capacity required […]
Lilygo released the T-Zigbee featuring the ESP32-C3 and TLSR8258 microcontrollers
https://www.electronics-lab.com/lilygo-released-the-t-zigbee-featuring-the-esp32-c3-and-tlsr8258-microcontrollers/
The China-based embedded electronics specialist, Lilygo, has released a low-cost development board, the T-Zigbee board that combines the ESP32-C3 microcontroller and the Telink TLSR8258 multi-protocol wireless SoC. The ESP32-C3 is a single-core Wi-Fi and Bluetooth 5 (LE) microcontroller SoC, which includes a 32-bit RISC-V core running at up to 160MHz alongside 400kB of SRAM. It […]
Esperanto Technologies’ Evaluation Program gives access to the ET-SoC-1 AI inference accelerator
https://www.electronics-lab.com/esperanto-technologies-evaluation-program-gives-access-to-the-et-soc-1-ai-inference-accelerator/
At the Hot Chips 33 conference, California-headquartered Esperanto Technologies, known for providing high-performance machine learning inference accelerators, unveiled the company’s new ET-SoC-1 “supercomputer-on-a-chip” based on the RISC-V open-standard instruction set architecture. On April 20, 2022, Holly Stump, an Integrated Marketing Consultant with Esperanto Technologies, announced the initial evaluation for its ET-SoC-1 AI inference accelerators with […]
MediaTek releases its Genio 1200 AIoT Chip for designers and OEMs
https://www.electronics-lab.com/mediatek-releases-its-genio-1200-aiot-chip-for-designers-and-oems/
MediaTek is popular in designing chipsets for mobile phones and wearable devices, but over the past couple of years, the manufacturer has set its footprint in the AIoT market, serving customers across a variety of industries. On May 10, 2022, MediaTek unveiled another Genio AIoT platform with its newly designed Genio 1200 chipset, adding to […]