Fujitsu Semiconductor Releases World’s Largest Density 8Mbit ReRAM Product from September
IC

Fujitsu Semiconductor Releases World’s Largest Density 8Mbit ReRAM Product from September

Featuring memory with the industry's smallest read current, optimal for small wearable devices Fujitsu Semiconductor announced the release of the 8 Mbit ReRAM MB85AS8MT, which has the world's largest density as a mass-produced ReRAM product, available from September 2019. This ReRAM...

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Intelligent power module reduces power and noise for drives
IC

Intelligent power module reduces power and noise for drives

Mitsubishi Electric has released a new high-performance intelligent power module (IPM), the Super mini DIPIPM Ver.7, featuring reduced radiation noise and low power consumption for the inverter drive systems of air conditioners and other small-capacity motor drives. The device features...

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Mitsubishi Electric to Launch MelDIR Thermal Diode Infrared Sensor
Sensor

Mitsubishi Electric to Launch MelDIR Thermal Diode Infrared Sensor

Accurately detects heat to identify types of heat sources and specific human behavior Mitsubishi Electric Corporation announced that it will launch the Mitsubishi Electric Diode InfraRed sensor (MelDIR), a thermal sensor for applications in the fields of security, heating, ventilation...

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Microchip’s SAM R30 Sub-GHz Module for Ultra-Low-Power WPAN Designs
RF

Microchip’s SAM R30 Sub-GHz Module for Ultra-Low-Power WPAN Designs

Mouser Electronics is now stocking the SAM R30 sub-GHz module from Microchip Technology. The industry’s smallest IEEE 802.15.4-compliant module, the SAM R30 combines an ultra-low-power microcontroller with a sub-GHZ radio in a 12.7 × 11 mm package, enabling long-lasting battery life...

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AI Compute Acceleration Startup Builds the Largest Chip Ever For Deep Learning Applications
AI

AI Compute Acceleration Startup Builds the Largest Chip Ever For Deep Learning Applications

To meet the ever-increasing computational demands of AI, California based AI startup, Cerebras Systems, just recently unveiled its very first announced element claimed to be the most massive AI chip ever made. With an astounding measurement of 46,225 mm2 (up to 56.7 times more than the...

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New Kontron COMe-m4AL10 (E2) Module
SBC

New Kontron COMe-m4AL10 (E2) Module

The COMe-m4AL10 (E2) is ideally suited for use in industrial IoT and Industry 4.0 applications Kontron has introduced its new COMe-m4AL10 (E2) module. The module is available with either Intel Atom®, Intel® Pentium® or Intel® Celeron® processors of the latest 5th generation....

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Lumileds LUXEON MultiColor Module 2.5W
Led

Lumileds LUXEON MultiColor Module 2.5W

LUXEON MultiColor Module 2.5W - RGBW 4-in-1 package with leading performance The LUXEON MultiColor Module 2.5W is a 4-in-1 package that makes color tuning easier. Each channel is individually addressable, enabling a large color gamut while simplifying the ability of getting just the...

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Say “Hello” The New Feather-Compactible OrangeCrab Board
FPGATop Stories

Say “Hello” The New Feather-Compactible OrangeCrab Board

Owing to the trend that is driving the success of the Feather form factor for boards is the change in the methodology and languages in which boards are now being programmed. It is quite certain that the maker market is in its transition state and it is hard to tell what the next...

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