Congatec conga-HPC/cBLS: High-Performance COM-HPC Module with Intel Core S-Series Processors

Germany’s Congatec has introduced the conga-HPC/cBLS, a high-performance COM-HPC Computer-on-Module (COM) powered by Intel Core S-Series processors (codenamed Bartlett Lake S). This new addition to Congatec’s COM-HPC COM portfolio targets edge and real-time applications with demanding computing needs, such as healthcare, and offers advanced features like AI inference support.

The COM-HPC Client Size C module, measuring 120 x 160 mm, leverages the hybrid performance architecture of Intel Core S processors (codenamed Bartlett Lake S). It features up to 16 Efficient (E) cores and 8 Performance (P) cores, supporting a total of 32 threads. The module offers up to 42 PCIe lanes, including 16 lanes with PCIe Gen 5 and up to 12 lanes with PCIe Gen 4. Integrated Intel Graphics, equipped with up to 32 execution units, support edge AI inference, while fast DDR5-4000 memory with ECC ensures reliability for data-critical applications.

Congatec conga-HPC/cBLS specifications:

• Processor:
  • Intel Core 3 201E: Quad-core with 4x P-cores clocked at 3.6 GHz / 4.8 GHz (Turbo), 12MB cache, 24 EU Intel UHD Graphics 770, PBP: 60W
  • Intel Core 5 211E: 10-core with 6x P-cores @ 2.7 GHz / 4.9 GHz (Turbo), 4x E-cores @ 2.0 GHz / 3.7 GHz (Turbo), 20MB cache, 24 EU Intel UHD Graphics 770, PBP: 65W
  • Intel Core 7 251E: 24-core with 8x P-cores @ 2.1 GHz / 5.6 GHz (Turbo), 16x E-cores @ 1.6 GHz / 4.4 GHz (Turbo), 36MB cache, 32 EU Intel Xe Architecture UHD Graphics 770, PBP: 65W
• Chipset: Bartlett Lake-S SoC with R680E or Q670E
• Memory:
  • 4x SO-DIMM sockets supporting DDR5 modules up to 32 GB each
  • Maximum capacity of 128 GB RAM
• Storage:
  • 32Mb SPI Flash for AMI BIOS
  • 2x SATA ports
• Networking: Dual 2.5 GbE ports with TSN support via Intel i226 Ethernet controller series
• Display Support: 3x DDI (DisplayPort/HDMI) and eDP (embedded DisplayPort)
• USB:
  • 4x USB 3.2 Gen2x2 ports
  • 4x USB 2.0 ports
• PCIe Expansion:
  • PCIe Gen 5 x16 PEG port
  • 3x PCIe Gen 4 (x4 lanes)
  • Up to 3x PCIe Gen 3 (x4 lanes)
  • 1x PCIe Gen 3 (x2 lanes)
• I/O and Expansion:
  • 2x 400-pin connectors for low-speed I/Os
  • 2x UART, 12x GPIOs
• Integrated Intel Graphics: Up to 32 execution units (UHD Graphics 770 or Xe Architecture)
• Embedded Controller Features:
  • Congatec Board Controller
  • Multi-stage watchdog, non-volatile user data storage
  • Board statistics, manufacturing, and hardware health monitoring
  • I²C bus (fast mode, 400 kHz, multi-master)
• BIOS Features:
  • LCD control, display auto-detection, backlight control
  • Flash update support
• Security: Trusted Platform Module (TPM 2.0)
• Power Management: ACPI 5.0a with battery support
• Operating Conditions:
  • Temperature: 0°C to 60°C (operating), -20°C to 80°C (storage)
  • Humidity: 10% to 85% r.H. (operating), 5% to 85% r.H. (storage)
• Dimensions: 160 x 120 mm (COM-HPC Client Size C)

conga-HPC/uATX-Client specifications:

• Board Type: Micro-ATX carrier board supporting COM-HPC Client Type Modules (Sizes A, B, C)
• Display Options:
  • 1x eDP (optional for LVDS)
  • 3x DP++ with 8.1 Gbps re-driver
• Audio:
  • 1x 4-pin audio jack with on-carrier HDA codec
  • 1x DMIC header
  • 1x I2S/SoundWire header
• Networking: 2x 10GbE RJ45 LAN ports with IEEE1588 support
• USB Interfaces:
  • 1x Dual USB 2.0 port
  • 2x Dual USB 3.2 Gen2 (up to 10Gbps)
  • 2x USB 4.0 with Thunderbolt Retimer (1x supports Power Delivery)
• Expansion Slots:
  • 1x 24-pin ATX power connector
  • 2x PCIe Gen4 x16 slots
  • 2x PCIe Gen4 x4 slots
  • 2x SATA III connectors
  • 1x 2.5-inch disk drive power connector
  • 1x M.2 Key B (2242/3042/2260/2280; USB2, PCIe x2, SIM)
  • 1x M.2 Key E (2230/3030; USB2, PCIe x2)
  • 1x M.2 Key M (2242/2260/2280/22110; PCIe x4, bottom side)
• Camera and I/O:
  • 2x MIPI CSI2/3 4-lane camera FFC connectors
  • 2x UART (native by module)
  • 2x UART (via Super I/O)
  • 1x General Purpose SPI
  • 2x I2C headers
  • 1x SMB header
  • 12x GPIO pins via header
  • 1x Feature header with system control signals
  • 1x Intel ISP header
• Miscellaneous:
  • 1x System fan connector
  • 1x CPU fan connector
  • 1x RTC CMOS battery holder
  • Buttons: Power, Reset, LID, and Sleep
  • 1x SPI boot flash socket
• Power Supply:
  • 1x AT banana power jack (8-20V)
  • Supports ACPI 6.0 Power Management
• Temperature Range:
  • Operating: 0°C to +60°C
  • Storage: -20°C to +80°C
• Humidity:
  • Operating: 10–85% RH (non-condensing)
  • Storage: 5–85% RH (non-condensing)
• Dimensions: 244 mm x 244 mm

The COM-HPC Client Size Computer-on-Module (COM) is designed for high-performance real-time applications with workload consolidation. It is well-suited for sectors such as medical imaging, test and measurement, communication and networking, retail, energy, and banking. Additional applications include video surveillance for traffic monitoring and automation tasks like optical inspection, which benefit from the module’s advanced performance capabilities. Optional features include system consolidation with aReady.VT and robust IoT connectivity.

The module supports multiple operating systems, including Microsoft Windows 11, Windows 11 IoT Enterprise, Windows 10, Windows 10 IoT Enterprise, Linux, Yocto, and the RTS Real-Time Hypervisor. With firmware-integrated Hypervisor-on-Modules, the COM module is ideal for diverse use cases, such as visualizations in test and measurement systems, real-time control of production cells with HMIs, IoT gateways, and edge servers in smart grids.

Congatec has not disclosed availability or pricing details. Further information is available on the product pages for the conga-HPC/cBLS module, the conga-HPC/uATX-Client micro-ATX carrier board, and aReady.COM.

Please follow and like us: