iWave Systems launches i.MX 8M Plus OSM Module: A Solderable System-On-Module
SBC-SiP-SoC-CoM

iWave Systems launches i.MX 8M Plus OSM Module: A Solderable System-On-Module

Building on the new industry standard “Open Standard Module (OSM)” defined by SGeT, iWave Systems launches iW-RainboW-G40M: The solderable i.MX 8M Plus OSM LGA Module. iW-RainboW-G40M integrates the powerful i.MX 8M Plus processor in the compact OSM 1.0 standard, delivering powerful...

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SMART Wireless launches a new SoM based on Snapdragon™ 660
SBC-SiP-SoC-CoM

SMART Wireless launches a new SoM based on Snapdragon™ 660

SMART Wireless Computing® (part of SMART Global Holdings), a leading provider of Snapdragon™ embedded computing platforms and solutions, today announced a compact compute module in an LGA package, Inforce 6503. Inforce 6503 enables advanced visual computing, enhanced graphics,...

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New TQ module based on ARM® Cortex®-A53 with i.MX8M Mini and Nano technology
SBC-SiP-SoC-CoM

New TQ module based on ARM® Cortex®-A53 with i.MX8M Mini and Nano technology

The technology company TQ is expanding its i.MX8 product range with the new embedded module TQMa8MxML based on the i.MX8M Mini and Nano CPU family. It supports all nine CPU derivatives of the two families on the small LGA module and all signal pins are available in every...

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TechNexion XORE is a tiny NXP i.MX 8M Mini LGA System-on-Module
SBC-SiP-SoC-CoM

TechNexion XORE is a tiny NXP i.MX 8M Mini LGA System-on-Module

There are several ways to design a system-on-module to carrier board interface, one method is to design an LGA (Land Grid Array) module, which have to be soldered straight unto the carrier board, and enables much more compact system-on-modules, and that’s exacty what TechNexion has...

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IDT Announces High Performance MEMS Relative Humidity & Temperature Sensor
Sensor

IDT Announces High Performance MEMS Relative Humidity & Temperature Sensor

California based company, Integrated Device Technology (IDT) has recently announced their new HS300x family of MEMS high-performance relative humidity (RH) and temperature sensors of dimension 3.0 × 2.41 × 0.8 mm DFN-style 6-pin LGA. Currently, there are four devices in this...

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