Boardcon LGA3576 SoM and Idea3576 SBC Feature Rockchip RK3576 SoC with 6 TOPS NPU and RK806S-5 PMIC
https://www.electronics-lab.com/boardcon-lga3576-som-and-idea3576-sbc-feature-rockchip-rk3576-soc-with-6-tops-npu-and-rk806s-5-pmic/
In recent times, Boardcon unveiled the 6TOPS AI-capable LGA3576, a state-of-the-art embedded system-on-module (SoM) with a 330-pad LGA layout that is powered by the Rockchip RK3576 AI SoC and the Idea3576 single board computer (SBC). It safeguards seamless multitasking for applications including 4K/8K video surveillance, digital signage, AV processing systems and AIoT edge devices (smart […]
Panasonic PAN B511-1C: nRF54L15-Based Bluetooth 6.0 and 802.15.4 Module with Secure IoT Features
https://www.electronics-lab.com/panasonic-pan-b511-1c-nrf54l15-based-bluetooth-6-0-and-802-15-4-module-with-secure-iot-features/
Panasonic Industry has launched the PAN B511-1C, a small, cost-effective Bluetooth 6.0 module designed for high-performance Bluetooth Low Energy applications and ultra-low-power wireless communication. Built around the Nordic nRF54L15 single-chip controller, it offers impressive performance and memory while keeping power consumption to a minimum. Featuring a hybrid Castellated holes and LGA footprint design, the module […]
u-blox RUBY-W2 Series: Automotive Wi-Fi 7 Modules with Qualcomm QCA6787AQ/QCA6797AQ for In-Vehicle Connectivity
https://www.electronics-lab.com/u-blox-ruby-w2-series-automotive-wi-fi-7-modules-with-qualcomm-qca6787aq-qca6797aq-for-in-vehicle-connectivity/
u-blox has introduced its first industrial automotive-grade Wi-Fi 7 host-based modules, the RUBY-W2 series (RUBY-W273-05A and RUBY-W295-05A). These modules enable OEMs to enhance in-vehicle infotainment and telematics by supporting Multi-Link Operation (MLO) use cases, delivering high-performance wireless connectivity. Powered by automotive-qualified Qualcomm QCA6797AQ or QCA6787AQ chipsets, the RUBY-W2 modules support tri-band Wi-Fi 7 and dual-mode […]
iWave Systems launches i.MX 8M Plus OSM Module: A Solderable System-On-Module
https://www.electronics-lab.com/iwave-systems-launches-i-mx-8m-plus-osm-module-a-solderable-system-on-module/
Building on the new industry standard “Open Standard Module (OSM)” defined by SGeT, iWave Systems launches iW-RainboW-G40M: The solderable i.MX 8M Plus OSM LGA Module. iW-RainboW-G40M integrates the powerful i.MX 8M Plus processor in the compact OSM 1.0 standard, delivering powerful AI and Machine learning capabilities on a compact edge device. The OSM Standard defines […]
SMART Wireless launches a new SoM based on Snapdragon™ 660
https://www.electronics-lab.com/smart-wireless-launches-new-som-based-snapdragon-660/
SMART Wireless Computing® (part of SMART Global Holdings), a leading provider of Snapdragon™ embedded computing platforms and solutions, today announced a compact compute module in an LGA package, Inforce 6503. Inforce 6503 enables advanced visual computing, enhanced graphics, and on-device machine learning capabilities featuring the Qualcomm® Snapdragon™ 660 processor. The Inforce 6503 SoM powered by […]
New TQ module based on ARM® Cortex®-A53 with i.MX8M Mini and Nano technology
https://www.electronics-lab.com/new-tq-module-based-arm-cortex-a53-mx8m-mini-nano-technology/
The technology company TQ is expanding its i.MX8 product range with the new embedded module TQMa8MxML based on the i.MX8M Mini and Nano CPU family. It supports all nine CPU derivatives of the two families on the small LGA module and all signal pins are available in every configuration. The i.MX8M Mini and Nano CPUs […]
TechNexion XORE is a tiny NXP i.MX 8M Mini LGA System-on-Module
https://www.electronics-lab.com/technexion-xore-tiny-nxp-mx-8m-mini-lga-system-module/
There are several ways to design a system-on-module to carrier board interface, one method is to design an LGA (Land Grid Array) module, which have to be soldered straight unto the carrier board, and enables much more compact system-on-modules, and that’s exacty what TechNexion has done with their XORE family of LGA system-on-module currently powered […]
IDT Announces High Performance MEMS Relative Humidity & Temperature Sensor
https://www.electronics-lab.com/71705-2/
California based company, Integrated Device Technology (IDT) has recently announced their new HS300x family of MEMS high-performance relative humidity (RH) and temperature sensors of dimension 3.0 × 2.41 × 0.8 mm DFN-style 6-pin LGA. Currently, there are four devices in this family—the HS3001, HS3002, HS3003, and HS3004. They are all the same from the view […]