Engicam SmarCore iQ6 SMARC Module Runs Qualcomm IQ-615 Processor With Adreno GPU
https://www.electronics-lab.com/engicam-smarcore-iq6-smarc-module-runs-qualcomm-iq-615-processor-with-adreno-gpu/
The SMARC 2.2 SmarCore iQ6 integrates Qualcomm’s IQ-615 processor, LPDDR4X memory, and multiple high-speed interfaces for industrial IoT, edge AI, and embedded computing applications.
Forlinx FET-MX9596-C NXP i.MX95 SoM With 2 TOPS AI And 10GbE
https://www.electronics-lab.com/forlinx-fet-mx9596-c-nxp-i-mx95-som-with-2-tops-ai-and-10gbe/
A compact NXP i.MX95 SoM with Cortex-A55 cores, 2 TOPS NPU, rich I/O, and a matching development board for edge AI and industrial systems.
SECO Launches Pi Vision 10.1 CM5 Industrial HMI Panel Powered by Raspberry Pi CM5
https://www.electronics-lab.com/seco-launches-pi-vision-10-1-cm5-industrial-hmi-panel-powered-by-raspberry-pi-cm5/
A 10.1-inch touchscreen panel built around Raspberry Pi Compute Module 5, designed for industrial control, IoT dashboards, and embedded HMI applications.
WINSYSTEMS SBC-ZETA-3950 Industrial Embedded SBC with Atom E3950
https://www.electronics-lab.com/winsystems-sbc-zeta-3950-industrial-embedded-sbc-with-atom-e3950/
Compact COM Express Mini board with Atom E3950, dual GbE, wide 6–36V input, and -40°C to +85°C support for industrial and vehicle deployments.
TOPST D3-G SBC With Telechips TCC8050 And Quad DisplayPort
https://www.electronics-lab.com/topst-d3-g-sbc-with-telechips-tcc8050-and-quad-displayport/
Automotive-grade SBC featuring a 9-core TCC8050 SoC, up to 8GB LPDDR4X, PowerVR GPU, quad-display DP 1.4 MST, dual MIPI-CSI, PCIe Gen3 x1, and triple CAN bus support.
8devices Maca 2 Long-Range Wireless Radio Reaches 80 km
https://www.electronics-lab.com/8devices-maca-2-long-range-wireless-radio-reaches-80-km/
High-power 2×2 MIMO radio with 39 dBm output, 2152–2852 MHz coverage, Linux OS, and dual Ethernet, built for drones, UAS, industrial IoT, and defense links.
SolidRun’s Fanless Industrial PCs Feature AMD Ryzen AI 300 Mobile AI SoC
https://www.electronics-lab.com/solidruns-fanless-industrial-pcs-feature-amd-ryzen-ai-300-mobile-ai-soc/
SolidRun has expanded its modular IPC lineup with the Bedrock RAI300, powered by AMD Ryzen AI 300 processors, targeting edge AI inference with higher NPU performance and fanless cooling.
Avalue ECM-ASL3 3.5-Inch SBC Supports Intel Alder Lake-N and Amston Lake SoCs
https://www.electronics-lab.com/avalue-ecm-asl3-3-5-inch-sbc-supports-intel-alder-lake-n-and-amston-lake-socs/
This rugged 3.5-inch SBC features Intel N97/i3-N305 processors, triple M.2 expansion, 2.5GbE LAN, and 9-36V input for edge AI applications.
ASUS UGen300 Βrings Hailo-10H Εdge AI Αcceleration Οver USB-C
https://www.electronics-lab.com/asus-ugen300-%ce%b2rings-hailo-10h-%ce%b5dge-ai-%ce%b1cceleration-%ce%bfver-usb-c/
The ASUS UGen300 is a USB AI accelerator with Hailo-10H, 40 TOPS performance, and 8GB memory, enabling plug-and-play edge inference on Linux, Windows, and Android systems.
Quectel i.MX 9 Industrial AIoT Modules Remove RF Complexity for Matter Gateways
https://www.electronics-lab.com/quectel-i-mx-9-industrial-aiot-modules-remove-rf-complexity-for-matter-gateways/
Quectel’s new i.MX 9 AIoT modules integrate Wi-Fi 6, Bluetooth 5.4, and 802.15.4 to simplify Matter border routers and industrial edge designs.