A 5nm GAAFET Chip By IBM, Samsung & GlobalFoundries

---

https://www.electronics-lab.com/5nm-gaafet-chip-ibm-samsung-globalfoundries/

In less than two years since making a 7nm test node chip with 20 billion transistors, scientists have paved the way for 30 billion switches on a fingernail-sized chip. IBM with its Research Alliance partners, GlobalFoundries and Samsung, have unveiled their industry-first process that will enable production of 5nm chips. The new 5nm technology is one of the […]

Samsung and Toshiba Will Start 64-layer 3D NAND Production Soon

---

https://www.electronics-lab.com/samsung-toshiba-will-start-64-layer-3d-nand-production-soon/

Toshiba will start mass production of 64-layer 3D NAND, BiCS3, with 3-bit-per-cell technology and a 64GB capacity in the first half of 2017. The applications of this new massive storage chip include enterprise and consumer SSD, smartphones, tablets and memory cards. This achievement succeeds the 48-layer BiCS FLASH one. Western Digital, the well known industry-leading […]

Samsung launches industry’s first 12Gb LPDDR4 DRAM

---

https://www.electronics-lab.com/samsung-launches-industrys-first-12gb-lpddr4-dram/

by Samsung: Samsung Electronics announced that it is mass producing the industry’s first 12-gigabit (Gb) LPDDR4 (low power, double data rate 4) mobile DRAM, based on its advanced 20-nanometer (nm) process technology. The newest LPDDR4 is expected to significantly accelerate the adoption of high capacity mobile DRAM worldwide. The 12Gb LPDDR4 brings the largest capacity and […]