Samsung unveils 12-layer 3D-TSV chip packaging technology
Technology

Samsung unveils 12-layer 3D-TSV chip packaging technology

An industry’s first, the 12-layer 3D-TSV (Through Silicon Via) technology developed by Samsung Electronics enables the stacking of 12 DRAM chips using more than 60,000 TSV holes, while maintaining the same thickness as current 8-layer chips. By Julien Happich @...

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Samsung Introduces Industry’s First 0.7μm-pixel Mobile Image Sensor
SensorTop Stories

Samsung Introduces Industry’s First 0.7μm-pixel Mobile Image Sensor

Samsung ISOCELL Slim GH1 offers 43.7 megapixels in an extremely compact package, ideal for slim full-display smartphones Samsung Electronics, a world leader in advanced semiconductor technology, today introduced the industry’s first 0.7-micrometer (μm)-pixel image sensor, the...

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Samsung announces 5G-capable Exynos processor
ICTop Stories

Samsung announces 5G-capable Exynos processor

Samsung Electronics Co. Ltd. has announced the Exynos 980 processor with an integrated 5G modem capable of download speeds of up to 2.55Gbps. report by Peter Clarke @ eenewsembedded.com The chip is designed in Samsung's 8nm manufacturing process technology and the CPU has a six-two...

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3D memory die boasts 100+ layer design
Technology

3D memory die boasts 100+ layer design

Samsung Electronics announced it has begun mass producing 250-gigabyte (GB) SATA solid state drive (SSD) that integrates the company’s sixth-generation (1xx-layer) 256-gigabit (Gb) three-bit V-NAND for global PC OEMs. by Julien Happich @ eenewseurope.com Utilizing...

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Samsung reveals 108Mp Image Sensor for Smartphones
IC

Samsung reveals 108Mp Image Sensor for Smartphones

Samsung Electronics introduced the 108 megapixel (Mp) Samsung ISOCELL Bright HMX, the first mobile image sensor in the industry to go beyond 100 million pixels. With the latest addition, Samsung will expand its 0.8μm image sensor offerings from its recently announced ultra-high 64Mp to...

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Samsung 12Gb LPDDR5 DRAM now in mass production
IC

Samsung 12Gb LPDDR5 DRAM now in mass production

Samsung Electronics announced it has begun mass producing the industry’s first 12-gigabit LPDDR5 mobile DRAM, optimized for enabling 5G and AI features in future smartphones. The new mobile DRAM memory comes just five months after announcing mass production of the 12GB LPDDR4X. The...

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Samsung’s Two New USB PD Controllers support up to 100W-charging
IC

Samsung’s Two New USB PD Controllers support up to 100W-charging

SE8A is the first power delivery controller with embedded Secure Element for added protection against unauthorized chargers The new chips support up to 100W-charging and meets latest USB-PD 3.0 specifications. Samsung Electronics, a world leader in advanced semiconductor technology,...

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0.8μm smartphone image sensor packs 64 megapixels
Sensor

0.8μm smartphone image sensor packs 64 megapixels

Samsung has expanded its 0.8μm pixel image sensor lineup with the 64-megapixel Isocell Bright GW1 and the 48Mp Isocell Bright GM2. Isocell Bright GW1 is a 64Mp image sensor that features the highest resolution in Samsung’s 0.8μm-pixel image sensor lineup. With pixel-merging...

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