HBM4 Is Here: Samsung Begins Mass Production of Commercial Units
https://www.electronics-lab.com/hbm4-is-here-samsung-begins-mass-production-of-commercial-units/
The high-bandwidth memory 4 (HBM4) delivers consistent 11.7 Gbps transfer speeds on its 1c DRAM process node with a 4 nm logic base die.
anyon_e DIY Laptop Features Rockchip RK3588 SoC, FriendlyELEC CM3588 Core Board and 13.3-inch 4K AMOLED display
https://www.electronics-lab.com/anyon_e-diy-laptop-features-rockchip-rk3588-soc-friendlyelec-cm3588-core-board-and-13-3-inch-4k-amoled-display/
The anyon_e DIY is a custom Linux-capable laptop designed by Bryan Huang and built around the FriendlyELEC CM3588 core board. This core board features the Rockchip RK3588, a high-performance ARM-based processor commonly used in edge computing, NAS systems, and multimedia applications. The laptop integrates this processor module with a custom-designed mainboard to support external components and […]
Samsung takes on Murata with MLCC for 5G smartphones
https://www.electronics-lab.com/samsung-takes-on-murata-with-mlcc-for-5g-smartphones/
Samsung is taking on Murata with a 1209 MLCC that is 18 percent thinner at 0.65mm and replaces four other devices in 5G smartphones. By Nick Flaherty @ eenewseurope.com Samsung Electro-Mechanics has developed a 0.65mm 1209 format multilayer ceramic capacitor (MLCC) for 5G smartphones that is 18 percent thinner than previous products. It plans to use […]
New OLED architecture has 10,000 PPI resolution
https://www.electronics-lab.com/new-oled-architecture-has-10000-ppi-resolution/
Researchers at Samsung in Korea and Stanford University in the US have developed and patented a new architecture for OLED displays with resolution up to 10,000 pixels per inch (PPI). by Nick Flaherty @ eenewsembedded.com The design uses adapted an electrode ultra-thin solar panels with a base layer of reflective metal with nanoscale corrugations, called […]
Samsung Electronics Unveils Its First Family of ‘Human-centric’ LED Components to Enhance Indoor Lifestyles
https://www.electronics-lab.com/samsung-electronics-unveils-first-family-human-centric-led-components-enhance-indoor-lifestyles/
Lighting to energize or relax: new LED packages help improve alertness and the quality of sleep by adjusting melatonin levels. Samsung Electronics unveiled its first “human-centric” LED packages, collectively known as LM302N. Engineered with carefully created light spectra, the LM302N family helps human bodies adjust melatonin levels indoors, making people feel more energetic or relaxed […]
Samsung unveils 12-layer 3D-TSV chip packaging technology
https://www.electronics-lab.com/samsung-unveils-12-layer-3d-tsv-chip-packaging-technology/
An industry’s first, the 12-layer 3D-TSV (Through Silicon Via) technology developed by Samsung Electronics enables the stacking of 12 DRAM chips using more than 60,000 TSV holes, while maintaining the same thickness as current 8-layer chips. By Julien Happich @ eenewseurope.com Developed for the mass production of high-performance chips, the layered packaging technology requires pinpoint […]
Samsung Introduces Industry’s First 0.7μm-pixel Mobile Image Sensor
https://www.electronics-lab.com/samsung-introduces-industrys-first-0-7%ce%bcm-pixel-mobile-image-sensor/
Samsung ISOCELL Slim GH1 offers 43.7 megapixels in an extremely compact package, ideal for slim full-display smartphones Samsung Electronics, a world leader in advanced semiconductor technology, today introduced the industry’s first 0.7-micrometer (μm)-pixel image sensor, the 43.7-megapixel (Mp) Samsung ISOCELL Slim GH1. Thanks to advanced ISOELL Plus technology, the new ultra-high-resolution GH1 image sensor embraces […]
Samsung announces 5G-capable Exynos processor
https://www.electronics-lab.com/samsung-announces-5g-capable-exynos-processor/
Samsung Electronics Co. Ltd. has announced the Exynos 980 processor with an integrated 5G modem capable of download speeds of up to 2.55Gbps. report by Peter Clarke @ eenewsembedded.com The chip is designed in Samsung’s 8nm manufacturing process technology and the CPU has a six-two split little-big architecture divided between two 2.2GHz Cortex-A77 cores and […]
3D memory die boasts 100+ layer design
https://www.electronics-lab.com/3d-memory-die-boasts-100-layer-design/
Samsung Electronics announced it has begun mass producing 250-gigabyte (GB) SATA solid state drive (SSD) that integrates the company’s sixth-generation (1xx-layer) 256-gigabit (Gb) three-bit V-NAND for global PC OEMs. by Julien Happich @ eenewseurope.com Utilizing Samsung’s unique ‘channel hole etching’ technology, the new V-NAND adds around 40-percent more cells to the previous 9x-layer single-stack structure. […]
Samsung reveals 108Mp Image Sensor for Smartphones
https://www.electronics-lab.com/samsung-reveals-108mp-image-sensor-smartphones/
Samsung Electronics introduced the 108 megapixel (Mp) Samsung ISOCELL Bright HMX, the first mobile image sensor in the industry to go beyond 100 million pixels. With the latest addition, Samsung will expand its 0.8μm image sensor offerings from its recently announced ultra-high 64Mp to 108Mp, a resolution equivalent to that of a high-end DSLR camera. […]