AMD Launches Ryzen AI Embedded P100 and X100 With Up to 50 TOPS AI Power

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https://www.electronics-lab.com/amd-launches-ryzen-ai-embedded-p100-and-x100-with-up-to-50-tops-ai-power/

AMD is bringing its "Ryzen AI" branding to the embedded sector, with Zen 5 CPUs, RDNA 3.5 graphics, and an XDNA 2 NPU for Edge AI applications.

CES 2026: Broadcom Brings Edge AI to Wi-Fi 8 with New BCM4918 APU

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https://www.electronics-lab.com/ces-2026-broadcom-brings-edge-ai-to-wi-fi-8-with-new-bcm4918-apu/

The newly announced Wi-Fi 8 SoC integrates a proprietary Neural Engine and 10G PHYs to offload AI inference from the main CPU in next-gen residential access points.

Quectel i.MX 9 Industrial AIoT Modules Remove RF Complexity for Matter Gateways

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https://www.electronics-lab.com/quectel-i-mx-9-industrial-aiot-modules-remove-rf-complexity-for-matter-gateways/

Quectel’s new i.MX 9 AIoT modules integrate Wi-Fi 6, Bluetooth 5.4, and 802.15.4 to simplify Matter border routers and industrial edge designs.

CES 2026: Intel Debuts Wildcat Lake Core Series 3 Processors with 40 TOPS AI

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https://www.electronics-lab.com/ces-2026-intel-debuts-wildcat-lake-core-series-3-processors-with-40-tops-ai/

Intel showed off "Wildcat Lake" Core Series 3 chips with 6 cores, Xe3 graphics and NPU 5 at CES 2026. This budget 18A (1.8 nm) processors offer 40 TOPS AI performance.

Dracula Technologies Announces Enhanced Light Energy Harvesting OPV

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https://www.electronics-lab.com/dracula-technologies-announces-enhanced-light-energy-harvesting-opv/

At CES 2026, Dracula Technologies unveiled the next generation of its LAYER OPV module, targeting battery-free IoT devices in indoor ambient lighting conditions.