Tag: Murata

Murata’s Type 2BZ module is packaged in a shielded form factor that facilitates integration into size- and power-sensitive applications Murata’s Type 2BZ high-performance module is based on Infineon's CYW54590 combo chipset, which supports Wi-Fi 802.11a/b/g/n/ac 2x2 MIMO +...

Murata has announced the new MRD series of open-loop current sensors that integrates high-performance tunnel magneto-resistive (TMR) elements - enabling precision measurement with regard to both DC and AC currents up to 40A, along with maintaining stable characteristics across an...

The new SCL3400 MEMS inclinometer from Murata is suitable for industrial applications that require high stability, accuracy and reliability. Featuring minimal offset drift of ≤0.12° over its lifetime, the SCL3400 can be used in isolated locations with little or no maintenance, as no...

Murata’s inclinometer is ideal for inclination and acceleration measurements in industrial applications Based on Murata's proven 3D-MEMS sensing technology, the SCL3300-D01 is a 3-axis (XYZ) inclinometer with four user-selectable measurement modes which can be used to optimize...

Murata Electronics Type 1XK Wi-Fi®+BLUETOOTH® Module is a small and high-performance module based on the NXP IW416 combo chipset. This module offers Wi-Fi 802.11a/b/g/n, Bluetooth 5.2 BR/EDR/LE, with up to 150Mbps PHY data rate on Wi-Fi, and 3Mbps PHY data rate on Bluetooth. The...

Murata's MEMS SMD Resonator features an innovative, space-saving design with built-in load capacitors. Murata’s MEMS resonators achieve excellent frequency, accuracy, and stable temperature characteristics without the use of active elements to correct the initial frequency and...

Measuring 1812 inch, Murata’s new broadband inductors for Bias-T circuits provide high inductance of 22 μH and high current of 700 mA in vehicle-mounted PoC used in SerDes interfaces. These new inductors use Murata's original ceramic materials and coil structures to offer high...

Murata has developed a silicon process technology capable of fabricating silicon capacitors with a density of 1.3 µF/mm². Intended for the mobile and high-performance computing (HPC) markets these devices have an extremely low ESL (few pH) and low ESR (few mΩ) which support the high...