Western Digital iNand IX EM132
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Western Digital iNand IX EM132

iNand IX EM132 - Industrial Embedded Flash Device. The Industrial iNAND IX EM132 Embedded Flash Drive (EFD) is Western Digital’s most advanced e.MMC flash storage solution for industrial applications, with high reliability and endurance across a wide range of operational...

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3D memory die boasts 100+ layer design
Technology

3D memory die boasts 100+ layer design

Samsung Electronics announced it has begun mass producing 250-gigabyte (GB) SATA solid state drive (SSD) that integrates the company’s sixth-generation (1xx-layer) 256-gigabit (Gb) three-bit V-NAND for global PC OEMs. by Julien Happich @ eenewseurope.com Utilizing...

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Greenliant Delivers Ultra-Fast Speeds with NVMe M.2 ArmourDrive SSDs
Products

Greenliant Delivers Ultra-Fast Speeds with NVMe M.2 ArmourDrive SSDs

Greenliant has started sampling its NVMe M.2 ArmourDrive™ solid state drive (SSD) modules to customers requiring high-performance, high-capacity removable data storage that can withstand extreme environments. The new industrial temperature (-40°C to +85°C) 88 PX Series NVMe M.2...

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3D TLC NAND Flash technology enters the Industry
ProductsTop Stories

3D TLC NAND Flash technology enters the Industry

3D TLC NAND flash based products are already dominating in SSD for consumers. Sophisticated NAND FLASH manufacturing technology, new advanced FLASH controllers and firmware now allow using 3D TLC NAND in industrial grade SSDs. Apacer introduces a new ST170 series in 2.5" SSD, M.2,...

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Understanding Flash Memory And How It Works
Science

Understanding Flash Memory And How It Works

Flash memory is one of the most widely used types of non-volatile memory. NAND Flash is designed for modern file storage which replaced old disk drives. This article provides a brief understanding of how NAND Flash technology works. The basic storage component used in Flash memory is a...

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SK Hynix Introduces Industry’s Highest 72-Layer 3D NAND Flash
ScienceTechnology

SK Hynix Introduces Industry’s Highest 72-Layer 3D NAND Flash

SK Hynix Incorporated introduced the world's first 72-Layer 256Gb (Gigabit) 3D (Three-Dimensional) NAND Flash based on its TLC (Triple-Level Cell) arrays and own technologies. This company also launched 6-Layer 128Gb 3D NAND chips in April 2016 and has been mass producing 48-Layer 256Gb...

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Samsung and Toshiba Will Start 64-layer 3D NAND Production Soon
ICTechnology

Samsung and Toshiba Will Start 64-layer 3D NAND Production Soon

Toshiba will start mass production of 64-layer 3D NAND, BiCS3, with 3-bit-per-cell technology and a 64GB capacity in the first half of 2017. The applications of this new massive storage chip include enterprise and consumer SSD, smartphones, tablets and memory cards. This achievement...

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Toshiba launches 256-Gbit 48-layer 3-D NAND flash
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Toshiba launches 256-Gbit 48-layer 3-D NAND flash

by Susan Nordyk @ edn.com: Ready for sampling in September, Toshiba’s 48-layer BiCS (Bit Cost Scalable) flash memory stores 256 Gbits using a 3-D vertically stacked cell structure and 3-bit-per-cell triple-level cell technology. By employing this 48-layer vertical stacking process,...

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