Nordic nRF93M1 LTE Cat-1 bis Cellular IoT Module Supports 10 Mbps LTE Connectivity
https://www.electronics-lab.com/nordic-nrf93m1-lte-cat-1-bis-cellular-iot-module-supports-10-mbps-lte-connectivity/
Designed for IoT devices, the nRF93M1 cellular module supports LTE Cat-1 bis connectivity, global bands, cloud integration, and a development kit for prototyping cellular applications.
Quectel FGH200M Wi-Fi HaLow Module Supports Long-Range IoT Connectivity
https://www.electronics-lab.com/quectel-fgh200m-wi-fi-halow-module-supports-long-range-iot-connectivity/
Designed for sub-GHz 802.11ah connectivity, the compact module enables long-distance communication, low power operation, and support for thousands of IoT devices.
LILYGO T-Halow P4 and T5 E-Paper S3 Pro Lite ESP32 Development Board Target IoT and Portable Display Applications
https://www.electronics-lab.com/lilygo-t-halow-p4-and-t5-e-paper-s3-pro-lite-esp32-development-board-target-iot-and-portable-display-applications/
Two new LILYGO boards combine long-range WiFi HaLow connectivity and a low-power ESP32-S3 e-paper display platform for wireless IoT and portable interface projects.
NFC Forum’s WLC and NDEF Specifications Formally Adopted as IEC Global Standards
https://www.electronics-lab.com/nfc-forums-wlc-and-ndef-specifications-formally-adopted-as-iec-global-standards/
The new IEC global standards IEC 63652-1:2026 (the NFC Wireless Charging Specification) and IEC 63652-2:2026 (the NFC Data Exchange Format Specification) aim to enable regulatory alignment and reduce market fragmentation.
Microchip Technology Introduces Single-Chip Multiprotocol Wireless Platform
https://www.electronics-lab.com/microchip-technology-introduces-single-chip-multiprotocol-wireless-platform/
The new PIC32-BZ6 wireless MCU family is a single-chip platform built to simplify the development of multiprotocol products in automotive, consumer, and industrial applications.
Nordic Semiconductor Expands nRF54L Series With High-Memory SoC
https://www.electronics-lab.com/nordic-semiconductor-expands-nrf54l-series-with-high-memory-soc/
The new nRF54LM20A ultra-low power wireless SoC features 2 MB non-volatile memory and 512 KB RAM, making it suitable for advanced wireless devices across consumer, industrial, and medical industries.
Ambiq Introduces Ultra-Low Power Wireless SoC for Edge AI Applications
https://www.electronics-lab.com/ambiq-introduces-ultra-low-power-wireless-soc-for-edge-ai-applications/
Ambiq’s new Apollo510B system-on-chip (SoC) features a 48 MHz network coprocessor and Bluetooth Low Energy 5.4 radio for wireless, low-power connectivity in wearable technology, industrial automation, and beyond.
LILYGO T3-S3 MVSR is A ESP32-S3 LoRa voice communication board with mic, speaker, and OLED
https://www.electronics-lab.com/lilygo-t3-s3-mvsr-is-a-esp32-s3-lora-voice-communication-board-with-mic-speaker-and-oled/
The T3-S3 MVSR by LILYGO is a compact LoRa voice communication kit designed for long-range audio transmission using LoRa technology. It features a built-in vibration motor, speaker (MAX98357A), microphone (MSM261S4030HOR), and a 0.96-inch OLED display with a resolution of 128×64, driven by the SSD1306 I2C interface. At its core, it is powered by the ESP32-S3FH4R2 […]
Quectel FCM363X wireless connectivity module has Wi-Fi 6 and Bluetooth 5.3
https://www.electronics-lab.com/quectel-fcm363x-wireless-connectivity-module-has-wi-fi-6-and-bluetooth-5-3/
Quectel has introduced a compact and high-performance wireless connectivity module, FCM363X, designed for short-range communication and supporting both Wi-Fi 6 and Bluetooth 5.3. The company emphasizes that this module is tailored for IoT applications, including smart home devices, industrial automation, and embedded systems. In terms of wireless capabilities, the module supports the 2.4GHz and 5GHz […]
Ceva introduces Ceva-Waves Links200 multi-protocol wireless connectivity platform IP
https://www.electronics-lab.com/ceva-introduces-ceva-waves-links200-multi-protocol-wireless-connectivity-platform-ip/
Ceva has introduced the Ceva-Waves Links200 multi-protocol wireless connectivity platform IP that integrates multiple communication standards into a single turnkey solution, particularly targeting smart edge devices such as hearables, wearables, and consumer electronics. Importantly, the Links200 platform allows multiple wireless standards to operate simultaneously, leveraging advanced coexistence mechanisms to reduce interference. It combines Bluetooth, Zigbee, […]