Join the Community
Main Menu
Siemens and ASU Launch Online PCB Design Microcredential Program
NXP RW610FML Module Brings Wi-Fi 6 and BLE 5.4 Connectivity
ESP32-C61-MINI-1 Brings Wi-Fi 6, BLE 5.3, and Matter Support
RAFI's Smart Encoder Brings Software-Defined Haptics to Rotary Controls
Prevent Post-Launch Application Failures with Real-World Network Simulation
The Approach to AI Infrastructure Is the Real Bubble
Mastering the Curve: Layout Strategies for FPC Bend Radius and Reliability
From Hearing to Understanding: MEMS Microphones as a Foundation of Robotic Perception
Analog To Digital Conversion - Sampling and Quantization
Positive Feedback in Electronic Circuits
Temperature Sensors
Magnetostatic Fields In Material Bodies
High Current Half Bridge with Over-Current Shutdown
3-Wire Electret Microphone Pre-Amplifier
12W Step Up DC-DC Converter using MAX1771
Sound to Light Color Shield for OLEDUINO v2
An Introduction to RF Theory, Practices, and Components: The Ins and Outs of RF
The Growing Decentralization of Power Grids
A new hands-on curriculum trains engineers on industry EDA tools to close the growing hardware design skills gap.
What if the AI bubble isn't the technology—it's the assumption that frontier-scale training infrastructure is what enterprises w...
At Embedded World 2026, Congatec unveiled new variants of its conga-TCRP1 COM Express module, launched the new conga-HPC/cBLS...
The new IEC global standards IEC 63652-1:2026 (the NFC Wireless Charging Specification) and IEC 63652-2:2026 (the NFC Data...
The new AI-powered antenna product recommendation engine uses over 20 years of design data to filter suitable products in...
ByteSnap Design has released an online BOM health calculator to help engineering teams evaluate component obsolescence risk and...
The LPDDR5X automotive DRAM has achieved the highest safety integrity level for automotive systems, meeting stringent...
The new EXMP-Q911 COM-HPC Mini module integrates Qualcomm's Dragonwing IQ-9075 processor, delivering 100 TOPS AI performance with...
The new Dragonwing Q-8750 and Q-7790 processors feature on-device AI, enhanced multimedia capabilities, and high-performance...
The Celus Design platform is now available through AGS Devices, featuring AI-powered application-ready schematic generation with...
The program offers cost-effective access to the 130 nm CMOS process, enabling students, researchers, and start-ups to tapeout...
The AI-powered hardware design platform can research parts, create schematics, and optimize supply chains; all while handling...
