HomeBusiness

Blog

Categories

The Approach to AI Infrastructure Is the Real Bubble

The Approach to AI Infrastructure Is the Real Bubble

What if the AI bubble isn't the technology—it's the assumption that frontier-scale training infrastructure is what enterprises w...

AI / ML Business Data Centers Embedded and Edge by Doug Milburn, 45Drives
Congatec Announces Edge Computing Modules and Full-Custom Design Service

Congatec Announces Edge Computing Modules and Full-Custom Design Service

At Embedded World 2026, Congatec unveiled new variants of its conga-TCRP1 COM Express module, launched the new conga-HPC/cBLS...

Business Industrial Memory by Electronics-Lab Staff
NFC Forum’s WLC and NDEF Specifications Formally Adopted as IEC Global Standards

NFC Forum’s WLC and NDEF Specifications Formally Adopted as IEC Global Standards

The new IEC global standards IEC 63652-1:2026 (the NFC Wireless Charging Specification) and IEC 63652-2:2026 (the NFC Data...

Business IoT RF / Wireless by Electronics-Lab Staff
AI Antenna Recommendation Engine: Taoglas Accelerates Product Selection

AI Antenna Recommendation Engine: Taoglas Accelerates Product Selection

The new AI-powered antenna product recommendation engine uses over 20 years of design data to filter suitable products in...

Business IoT RF / Wireless by Electronics-Lab Staff
Free BOM Assessment Tool Targets Component Lifecycle Management

Free BOM Assessment Tool Targets Component Lifecycle Management

ByteSnap Design has released an online BOM health calculator to help engineering teams evaluate component obsolescence risk and...

Business General Electronics by Electronics-Lab Staff
SK Hynix’s Latest Automotive DRAM Attains ISO 26262 ASIL-D Certification

SK Hynix’s Latest Automotive DRAM Attains ISO 26262 ASIL-D Certification

The LPDDR5X automotive DRAM has achieved the highest safety integrity level for automotive systems, meeting stringent...

Automotive Business Memory by Electronics-Lab Staff
Innodisk Teams Up With Qualcomm, Develops COM-HPC Mini Module

Innodisk Teams Up With Qualcomm, Develops COM-HPC Mini Module

The new EXMP-Q911 COM-HPC Mini module integrates Qualcomm's Dragonwing IQ-9075 processor, delivering 100 TOPS AI performance with...

Business Memory SoM / CoM by Electronics-Lab Staff
CES 2026: Qualcomm Debuts Next-Gen Dragonwing Q-Series Processors

CES 2026: Qualcomm Debuts Next-Gen Dragonwing Q-Series Processors

The new Dragonwing Q-8750 and Q-7790 processors feature on-device AI, enhanced multimedia capabilities, and high-performance...

AI / ML Business by Electronics-Lab Staff
AGS Devices and Celus Accelerate End-to-End Design to Procurement

AGS Devices and Celus Accelerate End-to-End Design to Procurement

The Celus Design platform is now available through AGS Devices, featuring AI-powered application-ready schematic generation with...

Business Comm and Networking EDA Tools by Electronics-Lab Staff
Cadence and Skywater Detail Next Open Multi-Project Wafer Shuttle Program

Cadence and Skywater Detail Next Open Multi-Project Wafer Shuttle Program

The program offers cost-effective access to the 130 nm CMOS process, enabling students, researchers, and start-ups to tapeout...

Business Comm and Networking EDA Tools by Electronics-Lab Staff
Meet Flux, the AI “Intern” Assisting in Concept to Creation for Hardware Design

Meet Flux, the AI “Intern” Assisting in Concept to Creation for Hardware Design

The AI-powered hardware design platform can research parts, create schematics, and optimize supply chains; all while handling...

Business EDA Tools General Electronics by Electronics-Lab Staff
e-con Systems Expands Camera Support for Renesas’ New RZ/G3E

e-con Systems Expands Camera Support for Renesas’ New RZ/G3E

e-con camera connected to RZ/G3E kit e-con Systems®, a leading embedded vision solutions provider, announces camera support for ...

Business Industrial by mixos