Qualcomm X105 5G Modem-RF Brings Release 19 and 14.8 Gbps Speeds
https://www.electronics-lab.com/qualcomm-x105-5g-modem-rf-brings-release-19-and-14-8-gbps-speeds/
Featuring agentic AI, quad-band GNSS, and NTN support, the X105 enables 5G Advanced with higher efficiency, faster speeds, and future-ready 6G testing capabilities.
8devices Maca 2 Long-Range Wireless Radio Reaches 80 km
https://www.electronics-lab.com/8devices-maca-2-long-range-wireless-radio-reaches-80-km/
High-power 2×2 MIMO radio with 39 dBm output, 2152–2852 MHz coverage, Linux OS, and dual Ethernet, built for drones, UAS, industrial IoT, and defense links.
Advantech 3.5-Inch SBC Features Qualcomm QCS6490 or QCS5430 SoC For Edge AI
https://www.electronics-lab.com/advantech-3-5-inch-sbc-features-qualcomm-qcs6490-or-qcs5430-soc-for-edge-ai/
The Advantech MIO-5355 is an industrial 3.5-inch SBC using Qualcomm QCS6490 or QCS5430 SoCs, offering LPDDR5 memory, rich I/O, edge AI acceleration, and long-term OS support.
CES 2026: Snapdragon X2 Plus 3nm SoCs Targets Copilot+ PCs With 80 TOPS AI and Multi-Day Battery
https://www.electronics-lab.com/ces2026-snapdragon-x2-plus-3nm-socs-targets-copilot-pcs-with-80-tops-ai-and-multi-day-battery/
The new platform brings the 3rd Gen Oryon CPU and an 80 TOPS NPU to the mainstream laptop market, promising multi-day battery life and advanced AI capabilities.
Luxonis OAK 4 AI Vision Camera Brings 52 TOPS Edge AI Performance
https://www.electronics-lab.com/luxonis-oak-4-ai-vision-camera-brings-52-tops-edge-ai-performance/
The OAK 4 series integrates on-device AI, depth sensing, and rugged IP67 hardware, enabling real-time computer vision without cloud or external host systems.
CES 2026: Qualcomm Debuts Next-Gen Dragonwing Q-Series Processors
https://www.electronics-lab.com/ces-2026-qualcomm-debuts-next-gen-dragonwing-q-series-processors/
The new Dragonwing Q-8750 and Q-7790 processors feature on-device AI, enhanced multimedia capabilities, and high-performance processing to advance consumer and industrial edge devices.
ST67W611M1: Qualcomm-Based Wi-Fi 6 and BLE IoT Module for STM32
https://www.electronics-lab.com/st67w611m1-qualcomm-based-wi-fi-6-and-ble-iot-module-for-stm32/
ST’s ST67W611M1 pairs Qualcomm QCC743 with STM32 MCUs, adding Wi-Fi 6, BLE 5.4, Matter, and Thread support for secure, low-power IoT designs.
Waveshare 5G/4G/3G Module Adds High-Speed Connectivity to Jetson Orin
https://www.electronics-lab.com/waveshare-5g-4g-3g-module-adds-high-speed-connectivity-to-jetson-orin/
Waveshare's Qualcomm-based 5G module features GNSS, dual SIM, USB 3.1, and multi-OS support for fast, reliable Jetson Orin connectivity.
Qualcomm Launches Industrial-Grade Processors for Intelligent Edge Solutions
https://www.electronics-lab.com/qualcomm-launches-industrial-grade-processors-for-intelligent-edge-solutions/
The Dragonwing IQ-X series processors provide “best-in-class” single and multithread performance for industrial PCs, PLCs, HMIs, and edge controllers in demanding industrial conditions.
Radxa Fogwise AIRbox Q900 Industrial Edge AI Box with 200 TOPS Power
https://www.electronics-lab.com/radxa-fogwise-airbox-q900-industrial-edge-ai-box-with-200-tops-power/
Compact industrial AI computer powered by Qualcomm IQ-9075 SoC, 36GB LPDDR5, 128GB UFS 3.1, dual 2.5GbE, and PCIe Gen4 SSD support for real-time robotics and vision workloads.