xMEMS Introduces Sycamore, the World’s First 1-mm Thin Near-Field Full-Range MEMS Micro Speaker
https://www.electronics-lab.com/xmems-introduces-sycamore-the-worlds-first-1-mm-thin-near-field-full-range-mems-micro-speaker/
At one-seventh the size and one-third the thickness of conventional dynamic-drivers, Sycamore gives product designers the space and freedom to innovate thinner and lighter mobile device form factors. Santa Clara, California, November 19, 2024 – xMEMS Labs, developers of the foremost platform for piezoMEMS innovation and creators of the world’s leading all-silicon micro speakers, today […]
Maker Go Launches Low-Cost Arduino UNO R4 Minima Clone for Under $1
https://www.electronics-lab.com/maker-go-launches-low-cost-arduino-uno-r4-minima-clone-for-under-1/
Maker Go, a Chinese hobbyist electronics specialist, has introduced a cost-effective alternative to the Arduino UNO R4 Minima, built around the same Renesas RA4M1 microcontroller. This clone significantly reduces the cost of entry, with an initial price of under $1 for a limited time. The Arduino UNO R4 Minima was launched as an upgrade to […]
AON1120 is a Ultra-Low-Power RISC-V SoC Designed for Always-On Edge AI Applications
https://www.electronics-lab.com/aon1120-is-a-ultra-low-power-risc-v-soc-designed-for-always-on-edge-ai-applications/
At CES2024, AONDevice unveiled its new on-device machine learning chip, the AON1120. It features a RISC-V core, two NPU coprocessors, and a DSP, and operates at a remarkably low power consumption of just 260μW for full-load audio classification tasks. The AON1120 is a system-on-chip that includes a RISC-V core, a DSP, and two NPUs for […]
IBM Advances Quantum Computing Roadmap with Heron Chip and System Two Launch
https://www.electronics-lab.com/ibm-advances-quantum-computing-roadmap-with-heron-chip-and-system-two-launch/
IBM has recently revealed updates to its quantum roadmap, marking a significant milestone by introducing the 133-qubit Heron chip and the groundbreaking System Two quantum computer. Heron stands out as the inaugural member of a new series of scalable quantum processors, meticulously engineered over four years to achieve IBM’s peak performance metrics and minimal error […]
Qualcomm introduces 10G Fiber Gateway platform to support high-performance Wi-Fi 7
https://www.electronics-lab.com/qualcomm-introduces-10g-fiber-gateway-platform-to-support-high-performance-wi-fi-7/
Qualcomm has developed a new product called the 10G Fiber Gateway platform that is designed to improve the performance of home broadband services. The solution combines high-performance Wi-Fi 7 and service-defined Wi-Fi technology to offer customizable services to subscribers. Unlike traditional broadband gateways, which have fixed configurations, Qualcomm’s platform features a software-defined gateway. This means […]
Top 10 Most Popular ICs in Today’s Electronics
https://www.electronics-lab.com/top-10-most-popular-ics-in-todays-electronics/
ICs or Integrated Chips are the fundamental building blocks of all modern-day electronic devices. They’re made of lots of tiny parts like resistors, capacitors, and transistors printed into a small piece of material known as silicon. These chips are in almost everything electronic we use in our day-to-day lives – from our phones and smartwatches to […]
Intel Launches Pathfinder for RISC-V to Help Hobbyists, Academics, and Industry Build RISC-V Chips
https://www.electronics-lab.com/intel-launches-pathfinder-for-risc-v-to-help-hobbyists-academics-and-industry-build-risc-v-chips/
It was indeed another win for RISC-V as Intel announced a big move to support the pre-silicon development of RISC-V devices with the launch of the Intel Pathfinder for RISC-V, a unified development environment for hobbyists and industries. Though a major leap for the RISC-V movement, this announcement was quite anticipated as the renewed interest […]
HARTING 3D-MID Component Carriers
https://www.electronics-lab.com/harting-3d-mid-component-carriers/
HARTING 3D-MID Component Carriers enable alternative component positioning and mounting utilizing fully automated assembly and soldering. These 3D molded interconnect devices can replace circuit boards utilizing a 3-dimensional circuit on molded plastic. This 3D shape can allow for more compact integration of electrical components into the available space. HARTING 3D-MID Component Carriers utilize a high-temperature […]
SkyWater and Google will use $15m Funding to expand an open source chip design project
https://www.electronics-lab.com/skywater-and-google-will-use-15m-funding-to-expand-an-open-source-chip-design-project/
SkyWater Technology has announced that it will be extending its partnership with Alphabet’s Google, releasing an open source Process Design Kit., for its commercial 90nm, fully depleted silicon on insulator (FDSOI), CMOS process technology. This announcement came shortly after the US chip manufacturer received $15 million in funding from the US Department of Defense (DOD). […]
Raspberry Pi Ramps Up The Production of RP2040, Beats the Chip Shortage
https://www.electronics-lab.com/raspberry-pi-ramps-up-the-production-of-rp2040-beats-the-chip-shortage/
Eben Upton, Founder and Chief Executive Officer of one of the very famous and successful embedded electronic hardware manufacturers, Raspberry Pi, has published news on January 17, 2022, aiming to beat the semiconductor chip shortage by introducing a dedicated Raspberry Pi store to purchase RPi’s inhouse silicon tape out RP2040 at a very low-cost. Due […]